Massive MIMO Antenna Board Layout for Direct Heat Dissipation

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Solution Overview

Problem

Existing massive multi-input and multi-output antenna apparatuses face inefficiencies in heat dissipation due to low thermal conductivity of substrates and require separate processing for heat dissipation, increasing manufacturing costs.

Innovation Solution

A massive multi-input and multi-output antenna apparatus with heat generating elements mounted directly on the back surface of a sub-board, utilizing a heat dissipation structure that includes a main board and sub-board stacked in close contact with a heat dissipation housing, and employing heat dissipation grooves and protrusions with interface materials for efficient heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat generating elements are mounted on the front surface of PBA with via holes for heat dissipation, then heat dissipation structure is provided, but heat dissipation efficiency is low due to small contact area and low thermal conductivity of substrate

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidheat dissipation structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent inverts the conventional mounting approach by mounting heat generating elements on the back surface of the PBA instead of the front surface. This inversion allows direct thermal contact with the heat dissipation housing, eliminating the need for via holes and heat transfer coins, thereby significantly improving heat dissipation efficiency while reducing structural complexity

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent extracts the heat dissipation function from the PBA substrate by directly mounting heat generating elements on the back surface in contact with the heat dissipation housing. This separates the heat generation function from the substrate, allowing the substrate to focus on electrical functions while heat dissipation is handled by the dedicated housing structure

Inventive Principle:

Principle #2Taking out (Extraction)

2Temperature

If heat transfer coins are installed to improve heat dissipation, then heat dissipation effect is enhanced, but contact tolerance reduces heat dissipation efficiency

Engineering Contradiction:

Improveheat dissipation effectVSAvoidcontact surface tolerance

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The patent eliminates heat transfer coins entirely by mounting heat generating elements directly on the back surface of the PBA. This removal of the intermediate heat transfer component eliminates the contact tolerance issue between the coin and the heat generating element, ensuring direct and reliable thermal contact with the heat dissipation housing

Inventive Principle:

Principle #2Taking out (Extraction)

3Temperature

If separate processing processes are used for heat dissipation, then heat dissipation function is provided, but manufacturing cost increases

Engineering Contradiction:

Improveheat dissipation functionVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent merges the heat generating element mounting with the heat dissipation function by placing both on the back surface of the PBA. This integration eliminates separate heat dissipation processing steps such as via hole formation and heat transfer coin installation, thereby reducing manufacturing complexity and cost while maintaining effective heat dissipation

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design simplifies the manufacturing process and reduces overall costs by eliminating the need for separate heat dissipation processing and improving heat dissipation efficiency through direct mounting and automated assembly.

Implementation Method 1

a back surface of both surfaces of the main board is in close contact with an inner surface of a heat dissipation housing

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

effectively discharge a large amount of driving heat generated in a main housing during operation to the outside

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentEP4648216A1Multi-input and multi-output antenna apparatus

Publication Date: 2025.11.12 KMW INC

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AI summary

Provided is a massive multi-input and multi-output antenna apparatus. The massive multi-input and multi-output antenna apparatus includes a main board stacked so that a back surface of the main board is in close contact with an inner surface of a heat dissipation housing, a sub board stacked to be in close contact with a front or back surface of the main board, a first heat generating element mounted only on the main board and mounted only on the back surface of the main board, which is a side provided with a plurality of heat dissipation fins, and a second heat generating element mounted only on the sub board and mounted only on a back surface of the sub board, which is a side provided with the plurality of heat dissipation fins, thereby preventing an increase in the product manufacturing cost through the automation and simplification of a product manufacturing process.