Massive MIMO Antenna Board Stacking for Direct Heat Dissipation

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Solution Overview

Problem

Existing massive multi-input and multi-output antenna apparatuses face inefficiencies in heat dissipation due to low thermal conductivity of substrates and require separate processing for heat dissipation, increasing manufacturing costs.

Innovation Solution

A massive multi-input and multi-output antenna apparatus design where heat generating elements are directly mounted on the back surface of a sub-board, utilizing a stacked structure with a main board and sub-board, and employing heat dissipation grooves and protrusions, along with a heat dissipation interface material, to enhance thermal contact and reduce processing steps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat generating elements are mounted on the front surface of PBA with via holes for heat dissipation, then heat dissipation structure is provided, but heat dissipation efficiency is low due to small contact area and low thermal conductivity of substrate

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidheat dissipation structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent inverts the conventional mounting approach by mounting heat generating elements on the back surface of the PBA instead of the front surface. This inversion allows direct thermal contact with the heat dissipation housing through the back surface, eliminating the need for via holes and heat transfer coins, thereby significantly improving heat dissipation efficiency while reducing structural complexity

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent extracts and eliminates the intermediate heat transfer components (via holes and heat transfer coins) from the heat dissipation path. By directly mounting heat generating elements on the back surface that contacts the heat dissipation housing, the patent removes unnecessary structural elements that were causing contact tolerance issues and reducing heat dissipation efficiency

Inventive Principle:

Principle #2Taking out (Extraction)

2Temperature

If via holes and heat transfer coins are used for heat dissipation, then heat dissipation path is provided, but manufacturing cost increases due to separate processing processes

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent merges the heat dissipation function with the mounting structure itself. By designing the PBA back surface to directly contact the heat dissipation housing and mounting heat generating elements on this surface, the patent combines the mounting function and heat dissipation function into a single integrated structure, eliminating separate processing steps for via holes and heat transfer coins installation

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If heat transfer coins are installed to improve heat dissipation, then contact area is increased, but heat dissipation effect is reduced due to contact tolerance

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidcontact surface tolerance

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The patent removes heat transfer coins from the heat dissipation path entirely. By directly mounting heat generating elements on the back surface of the PBA that is in close contact with the heat dissipation housing, the patent eliminates the intermediate heat transfer coin component that was causing contact tolerance issues, thereby ensuring optimal thermal contact without relying on precise alignment of multiple components

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design simplifies the manufacturing process and reduces overall costs by eliminating the need for separate heat transfer bridges, while improving heat dissipation efficiency through direct thermal contact and automated mounting processes.

Implementation Method 1

a heat dissipation housing 10 that surrounds the front surface of the sub-board 150

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The first heat generating element and the second heat generating element may be connected to corresponding points formed on the back surfaces of the main board and the sub-board by a brazing method using solder paste applied in advance to surfaces to be mutually joined

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250337149A1Multi-input and multi-output antenna apparatus

Publication Date: 2025.10.30 KMW INC

AI summary

Provided is a massive multi-input and multi-output antenna apparatus. The massive multi-input and multi-output antenna apparatus includes a main board stacked so that a back surface of the main board is in close contact with an inner surface of a heat dissipation housing, a sub board stacked to be in close contact with a front or back surface of the main board, a first heat generating element mounted only on the main board and mounted only on the back surface of the main board, which is a side provided with a plurality of heat dissipation fins, and a second heat generating element mounted only on the sub board and mounted only on a back surface of the sub board, which is a side provided with the plurality of heat dissipation fins, thereby preventing an increase in the product manufacturing cost through the automation and simplification of a product manufacturing process.