Mini-LED Backlight Module Glass Substrate TFT Driving
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Solution Overview
Problem
Existing mini-LED backlight modules for LCDs are thick and costly due to their manufacturing on printed circuit boards using metal-oxide-semiconductor transistors.
Innovation Solution
Manufacturing driving units with thin-film transistors on a glass substrate to drive mini-LEDs, which includes a switching module, a driving module, and a storing module, connected in a specific configuration to reduce thickness and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If active-matrix mini-LEDs are manufactured on a printed circuit board using metal-oxide-semiconductor transistors, then the mini-LEDs can be produced with mass transfer feasibility, but the LCD backlight module thickness increases and manufacturing cost increases
Solution Approach 1:
The patent extracts the transistor structure from the traditional thick PCB substrate and implements it on a thin glass substrate using thin-film transistor technology. This separation allows the mini-LED array to maintain mass production feasibility while dramatically reducing the overall backlight module thickness by eliminating the need for thick PCB and MOS transistor structures.
Solution Approach 2:
The patent changes the substrate material parameter from PCB (printed circuit board) to glass substrate, and the transistor type parameter from MOS (metal-oxide-semiconductor) to TFT (thin-film transistor). These parameter changes enable both mass production capability and reduced thickness, as TFTs on glass substrates have much smaller thickness characteristics compared to MOS transistors on PCBs.
2Productivity
If active-matrix mini-LEDs are manufactured on a printed circuit board using metal-oxide-semiconductor transistors, then the mini-LEDs can be produced with mass transfer feasibility, but the manufacturing cost increases
Solution Approach 1:
The patent changes the transistor technology parameter from MOS to TFT and the substrate parameter from PCB to glass substrate. This parameter change enables the use of more cost-effective thin-film fabrication processes that are compatible with large-area glass substrates, thereby reducing manufacturing costs while maintaining mass production feasibility for large-scaled display screens.
Solution Approach 2:
The glass substrate with TFTs serves multiple functions: it acts as both the structural support and the active driving circuit substrate. This multi-functionality eliminates the need for separate PCB and driver integrated circuits, reducing overall manufacturing complexity and cost while maintaining mass production capabilities.
3Area of stationary object
If mini-LEDs are used for large-scaled display screens, then the display area increases, but the backlight module thickness increases
Solution Approach 1:
The patent changes the substrate and transistor parameters to enable thin-film construction that scales well with area. The TFT-on-glass approach allows for large-area fabrication without proportionally increasing thickness, as the thin-film layers maintain consistent thickness regardless of the substrate area size, unlike traditional PCB-based approaches where thickness increases with scale.
Data Source
AI summary
The present application provides a backlight module, a display panel and an electronic device, including a substrate; a plurality of driving units, formed on the glass substrate; and a plurality of mini-LEDs, each of which includes a first electrode and a second electrode, wherein the driving unit includes a switching module, a driving module and a storing module, one end of the switching module is connected to the driving module and the storing module, the driving module is connected to the mini-LED.