Mini LED Backplane Conductive Layout Against Encapsulation Peeling
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Solution Overview
Problem
Mini LEDs in display technologies experience encapsulation peeling due to temperature changes, leading to device failure and reduced service life.
Innovation Solution
A backplane design with a substrate, circuit structure layer, reflective layer, and encapsulation portions, featuring specific conductive line configurations to prevent stress concentration and enhance film adhesion, thereby reducing peeling and improving temperature resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If Mini LEDs are used in display products, then high brightness and long service life are achieved, but encapsulation peeling occurs due to temperature changes
Solution Approach 1:
The conductive line is designed with varying line widths along its length, creating different local mechanical properties. The wider sections provide flexibility while narrower sections maintain structural integrity, allowing the conductive line to accommodate thermal expansion and contraction without causing encapsulation peeling.
Solution Approach 2:
The invention changes the geometric parameters of the conductive line by introducing multiple line width variations. This parameter modification allows the conductive line to have different stiffness characteristics at different locations, enabling it to withstand temperature-induced stress without breaking or causing encapsulation failure.
2Ease of manufacture
If conventional conductive line designs are used, then manufacturing is simple, but conductive lines break due to stress concentration during temperature changes
Solution Approach 1:
The conductive line incorporates local quality variations through different line widths at different positions. This design allows the conductive line to have optimized mechanical properties at each location, preventing stress concentration and breakage while maintaining manufacturability through standard PCB fabrication processes.
3Manufacturing precision
If uniform conductive line width is used, then manufacturing precision is easier to control, but stress distribution is uneven causing peeling and breakage
Solution Approach 1:
The conductive line is designed with intentional local quality variations in the form of different line widths. This non-uniform design actually improves overall stability by distributing stress more evenly throughout the structure, preventing both peeling and breakage while remaining compatible with standard manufacturing tolerances.
Data Source
AI summary
A backplane includes a substrate, a circuit structure layer, a reflective layer, a plurality of electronic devices and a plurality of encapsulation portions. Each encapsulation portion covers an electronic device in the plurality of electronic devices. At least one first conductive line includes at least one of a first linear extending portion, a second linear extending portion and a third linear extending portion. Orthographic projections of the first linear extending portion, the second linear extending portion, the third linear extending portion and an encapsulation portion in the plurality of encapsulation portions on the substrate are respectively a first orthographic projection, a second orthographic projection, a third orthographic projection and a fourth orthographic projection. The first orthographic projection is located within the fourth orthographic projection, the second orthographic projection is partially overlapped with the fourth orthographic projection, and the third orthographic projection is located outside the fourth orthographic projection.