Mini LED Driving Backplane Planarization for Flat Wiring and Welding
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Solution Overview
Problem
The existing Mini LED driving backplane designs face challenges such as wire breakage and poor welding due to height differences and uneven surfaces, which affect the display quality and reliability.
Innovation Solution
The proposed driving backplane structure includes a base substrate with a first conductive layer, a first planarization layer outside the conductive layer pattern, a second planarization layer overlapping the first conductive layer, and a second conductive layer on the second planarization layer, where the orthographic projection of the first conductive layer partially overlaps with the second conductive layer, and the planarization layers help in uniform thickness and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional Mini LED driving backplane structure is used, then the device can be manufactured, but height differences and uneven surfaces cause wire breakage and poor welding
Solution Approach 1:
The patent applies preliminary action by forming a planarization layer before the second conductive layer to pre-compensate for height differences. This planarization layer is deposited to fill valleys and create a flat surface, preventing wire breakage and ensuring good welding quality in advance before subsequent manufacturing steps occur.
Solution Approach 2:
The planarization layer acts as an intermediary between the first conductive layer and the second conductive layer. It mediates the height differences created by the patterned first conductive layer, providing a uniform intermediate surface that enables reliable wire formation and welding without direct contact between the uneven first conductive layer and the second conductive layer.
2Reliability
If the first conductive layer is made thicker to reduce resistance, then electrical performance improves, but height differences increase causing wire breakage
Solution Approach 1:
The planarization layer is formed in advance to compensate for the height differences created by the thick first conductive layer. By depositing this intermediate layer before forming the second conductive layer, the patent ensures that the electrical performance benefit of the thick first conductive layer is maintained while the surface flatness problem is pre-corrected.
3Reliability
If multiple pattern processes are used to form conductive layers with different thicknesses, then electrical performance improves, but manufacturing complexity increases
Solution Approach 1:
The patent merges the thickness control function into a single planarization step rather than requiring multiple separate pattern processes. The planarization layer is deposited uniformly and then patterned once to create the desired thickness variations, combining what would otherwise require multiple fabrication steps into one integrated process.
Data Source
AI summary
An embodiment of the present disclosure provides a driving backplane, which includes: a base substrate; a first conductive layer on the base substrate; a first planarization layer on the base substrate and in a region outside a pattern of the first conductive layer; a second planarization layer on a side of the first conductive layer and the first planarization layer distal to the base substrate; and a second conductive layer on a side of the second planarization layer distal to the base substrate, wherein an orthographic projection of the first conductive layer on the base substrate partially overlaps with an orthographic projection of the second conductive layer on the base substrate.