Mini LED Display Backplane Structure for Replaceable Light Units
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Solution Overview
Problem
Mini LED display screens face issues with lamp beads being lit at undesired locations or failing, requiring replacement of the entire lamp board due to low soldering adhesion of Mini LED chips, leading to high maintenance costs and resource waste.
Innovation Solution
A display backplane design featuring a substrate with a light-emitting layer, a protective layer having accommodating grooves for the light-emitting units, and an adhesive layer to securely attach the protective layer to the substrate, allowing for individual replacement of defective units without replacing the entire lamp board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If Mini LED chip is packaged with die-bonding glue to prevent falling off, then chip adhesion is improved, but individual chip replacement becomes impossible and maintenance cost increases
Solution Approach 1:
The patent divides the packaging structure into separate modular components: a support plate with recesses for each chip, and a protective plate with through-holes. This segmentation allows individual chip access and replacement while maintaining overall structural integrity, resolving the contradiction between strong adhesion and ease of repair.
Solution Approach 2:
The support plate acts as an intermediary structure between the substrate and the protective plate. It provides mechanical support and positioning for individual chips through recesses, enabling chip replacement without requiring removal of the entire packaging structure, thus facilitating repair while maintaining adhesion.
2Reliability
If entire lamp board is replaced when chip fails, then display reliability is maintained, but resource waste increases and maintenance cost rises
Solution Approach 1:
The modular packaging structure with individual chip recesses and through-holes enables segmentation of replacement operations. Only the defective chip needs to be removed and replaced, while functional chips remain in place. This maintains display reliability through proper chip replacement while minimizing resource waste by preserving working components.
Solution Approach 2:
The patent enables recovery and reuse of functional chips on the lamp board. By providing access to individual chips through the protective plate structure, working chips can be retained and only defective ones replaced, reducing resource waste while maintaining overall display reliability.
3Volume of moving object
If Mini LED chip contact area with pad is small, then chip size is reduced, but soldering adhesion decreases and chip stability worsens
Solution Approach 1:
The support plate with recesses serves as an intermediary mechanical support structure that compensates for the small soldering contact area. The recesses provide additional mechanical anchoring for the chips, enhancing stability and effective adhesion without increasing chip size, thus resolving the contradiction between small chip dimensions and sufficient bonding strength.
Data Source
AI summary
Disclosed is a display backplane and a mobile terminal. The display backplane includes a substrate, a light-emitting layer, and a protective layer. The light-emitting layer is disposed on the substrate, and the protective layer is disposed on the substrate. An accommodating groove is disposed on a surface of the protective layer facing the substrate, and the light-emitting unit is located in the accommodating groove.