Mini LED Drive Base Plate Structure for Adhesion and Oxidation Resistance
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Solution Overview
Problem
The yield of Mini LED products is affected by insufficient adhesive force between the conductive layer and the insulation layer in the drive base plate, leading to potential separation and poor electrical performance.
Innovation Solution
A drive base plate design that includes a substrate with a first conductive layer and a block layer, where the block layer is hollowed out to expose contact pads and provide oxidation resistance, improving the adhesive force with the insulation layer and preventing detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional conductive layer structure is used, then the manufacturing process is simple, but the adhesive force between the conductive layer and insulation layer is insufficient, leading to separation and poor yield
Solution Approach 1:
The conductive layer is designed as a composite structure comprising multiple layers: a copper layer providing electrical conductivity, a nickel layer providing adhesion and oxidation resistance, and a titanium layer enhancing adhesion to the insulation layer. This multi-material composite approach resolves the contradiction by achieving superior adhesive force and reliability while maintaining manufacturing feasibility through established sputtering and electroplating processes.
Solution Approach 2:
The titanium layer is selectively applied only in regions where enhanced adhesion is needed, specifically at the interface between the conductive layer and insulation layer. This localized application of the adhesion-promoting titanium layer addresses the adhesive force deficiency without unnecessarily complicating the entire structure, as the titanium is confined to specific functional zones rather than being applied universally.
2Reliability
If the conductive layer is exposed without protection, then the manufacturing process is simple, but the conductive layer oxidizes and loses electrical performance
Solution Approach 1:
The conductive layer employs a composite material structure with copper, nickel, and titanium layers. The nickel layer specifically provides oxidation resistance while maintaining electrical conductivity, protecting the copper from oxidizing. This composite approach ensures long-term electrical performance stability without requiring complex external protective structures, as the protection is integrated into the layer itself.
Solution Approach 2:
The nickel layer acts as an intermediary between the copper layer and the environment, preventing direct oxidation of the copper. This intermediate protective layer maintains electrical performance over time by blocking oxygen exposure to the conductive copper, while the titanium layer serves as another intermediary at the interface with the insulation layer, ensuring stable adhesion and preventing delamination that could expose conductive surfaces to oxidation.
3Reliability
If the contact pad area is increased to improve soldering, then the soldering quality improves, but the area available for other conductive portions decreases
Solution Approach 1:
The contact pad utilizes a composite material structure with copper, nickel, and titanium layers, where each material contributes specific properties. The copper provides excellent electrical conductivity for efficient signal transmission, the nickel provides adhesion and oxidation resistance for reliable soldering, and the titanium enhances bonding to the insulation layer. This optimized material composition allows for smaller contact pad areas to achieve the same soldering quality, thereby increasing the density of conductive portions that can be accommodated on the substrate.
Solution Approach 2:
The invention optimizes the thickness parameters of each layer in the contact pad structure. By precisely controlling the thickness of the copper layer (for conductivity), nickel layer (for adhesion), and titanium layer (for bonding), the design achieves high soldering quality with minimized contact pad footprint. This parameter optimization allows more contact pads and conductive portions to be packed into the available area, increasing productivity and component density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved adhesive force between the conductive and insulation layers enhances the yield and reliability of Mini LED products by preventing separation and ensuring stable electrical performance.
Implementation Method 1
a material of the first block layer includes an oxidation-resistant material
Data Source
AI summary
The present disclosure provides a drive base plate, a light-emitting base plate, a display device, and a manufacturing method for the drive base plate. The drive base plate includes: a substrate; and a first conductive layer and a first block layer disposed on the substrate, the first conductive layer includes multiple first conductive portions arranged at intervals, and each of the first conductive portions includes a first contact pad; the first block layer includes first hollowed-out regions, each of the first hollowed-out regions corresponds to a respective first contact pads, an orthographic projection of the first contact pad on the substrate is within the orthographic projection of the first hollowed-out region on the substrate, and the material of the first block layer includes an oxidation-resistant material.