Mini-LED Baseplate Bonding Layout to Prevent Film Layer Peeling
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Solution Overview
Problem
Mini-LED baseplates face issues with film layer peeling-off in the bonding region, leading to reduced product yield due to poor adhesive force and over-etching of insulation layers.
Innovation Solution
A light-emitting baseplate design featuring a bonding region with one layer of conductive structure, first insulation layer with openings, and a flux layer, which avoids separation of solder pads from the conductive film layer and prevents over-etching, enhancing adhesive strength and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers of conductive structure are used in the bonding region, then electrical connectivity is improved, but film layer separation occurs due to poor adhesive force
Solution Approach 1:
The patent extracts the conductive structure from the bonding region by relocating bonding pins to this area, allowing the bonding region to have only one insulation layer without underlying conductive layers, thereby eliminating the adhesion problem between multiple conductive layers
2Manufacturing precision
If the insulation layer is etched to expose conductive structures, then soldering accuracy is improved, but over-etching causes film layer separation
Solution Approach 1:
The patent removes the problematic multi-layer conductive structure from the bonding region, so that etching the insulation layer only needs to expose bonding pins without risking separation from underlying conductive layers, thus maintaining film layer integrity while achieving soldering precision
Solution Approach 2:
The patent applies different structural configurations to different regions: the bonding region has bonding pins with one insulation layer for easy etching control, while the light-emitting region has solder pads with two insulation layers for proper adhesion, optimizing each region's properties locally
Data Source
AI summary
The present disclosure provides a light-emitting baseplate and a display apparatus. The light-emitting baseplate includes a bonding region and a light-emitting region; the light-emitting baseplate includes a substrate, solder pads located on the substrate and in the light-emitting region, bonding pins located on the substrate and in the bonding region, and a first insulation layer located at a side of the bonding pins away from the substrate. The light-emitting region includes two layers of conductive structure, and the bonding region includes one layer of conductive structure. The first insulation layer is provided with first openings located in the bonding region, and an orthographic projection of each of the first openings on the substrate is within an orthographic projection of one of the bonding pins on the substrate. The display apparatus includes the light-emitting baseplate.