Mini LED Light Panel Layout for Driving Chip Heat Isolation
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Solution Overview
Problem
In mini LED display devices, the integration of mini LEDs and driving chips on a printed circuit board leads to increased heat dissipation challenges, as existing solutions either compromise on contrast, increase wiring complexity, or reduce brightness to mitigate heat effects.
Innovation Solution
A light panel design where the light-emitting element array and driving chip are positioned on opposite surfaces of a printed circuit board, with orthographic projections of light-emitting elements located outside the driving chip's projection, reducing direct heat influence and allowing for improved heat distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If mini LEDs and driving chips are integrated on the same PCB, then device complexity is reduced, but heat dissipation performance deteriorates due to increased thermal impact on the driving chip
Solution Approach 1:
The patent transitions from planar integration to three-dimensional spatial arrangement by positioning light-emitting elements on the front surface and driving chips on the rear surface of the PCB. This vertical separation in the third dimension reduces thermal coupling while maintaining electrical connectivity, effectively resolving the contradiction between integration and heat dissipation.
Solution Approach 2:
The PCB serves as an intermediary structure that simultaneously provides mechanical support, electrical connection, and thermal isolation. By routing signal lines through the PCB and positioning components on opposite surfaces, the intermediary structure enables integration while managing thermal effects.
2Area of stationary object
If light-emitting elements are positioned close to driving chips for compact design, then area is reduced, but heat dissipation performance worsens due to concentrated thermal load
Solution Approach 1:
Instead of increasing lateral distance between light-emitting elements and driving chips (which would increase area), the patent utilizes the vertical dimension by placing components on opposite surfaces of the PCB. This maintains compact footprint while reducing thermal influence through spatial separation.
3Ease of manufacture
If wiring layout is simplified for ease of manufacture, then manufacturing precision may be compromised, but heat dissipation can be improved through optimized routing
Solution Approach 1:
The patent segments the PCB into functional zones: front surface for light-emitting elements, rear surface for driving chips, and intermediate routing layers for signal lines. This segmentation simplifies wiring layout by organizing connections systematically while maintaining precise component positioning through standardized mounting areas.
Data Source
AI summary
A light panel, includes: a printed circuit board (PCB); a light emitting element array, comprising a plurality of light emitting elements disposed on a first surface of the PCB and arranged in an array in a first direction and in a second direction; and a driving chip, disposed on a second surface of the PCB, which is opposite to the first surface; wherein the light-emitting element array comprises a light-emitting element sub-array, and orthographic projections of at least portion of light-emitting elements of the light-emitting element sub-array on the PCB are located outside an orthographic projection of the driving chip on the PCB. A display device is further provided.