Mini-LED Light-Shielding Layout for Crosstalk Without Brightness Loss
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Solution Overview
Problem
The existing method of using thick black glues to reduce optical crosstalk between mini-LED or micro-LED chips results in brightness loss due to remaining black glues on the front surface of the chips.
Innovation Solution
A display device and manufacturing method that involves a driving substrate with light-emitting elements, a light-shielding layer filled in intervals between adjacent light-emitting elements, and an encapsulation substrate with a buffer layer, which improves optical crosstalk without affecting front light-emitting brightness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If thick black glues are made on the whole surface of mini-LED or micro-LED chips to block light from side surfaces, then optical crosstalk is reduced, but black glues remain on the front surface causing brightness loss
Solution Approach 1:
The patent applies local quality by making the black glue layer thin specifically at the front surface area of the light-emitting element, while maintaining adequate thickness at side surfaces for light blocking. This localized variation in thickness allows the same material layer to simultaneously achieve both light blocking function at sides and light transmission function at the front surface.
Solution Approach 2:
The patent transitions from a uniform two-dimensional black glue coating to a three-dimensional varying thickness structure. The black glue layer thickness changes across different spatial dimensions, being thicker at side surfaces for light blocking and thinner at the front surface for light emission, thus resolving the contradiction between light blocking and light emission requirements.
2Reliability
If black glue is applied to block light from side surfaces of light-emitting elements, then optical crosstalk between adjacent elements is reduced, but the remaining black glue on front surface causes brightness loss
Solution Approach 1:
The black glue layer is designed with locally different thicknesses: thicker portions at side surfaces provide reliable optical isolation between adjacent light-emitting elements, while thinner portions at front surfaces minimize impact on light emission efficiency. This local quality differentiation allows simultaneous achievement of both optical isolation and emission efficiency.
Solution Approach 2:
The patent changes the physical parameter of black glue layer thickness across different locations. By controlling the thickness parameter to vary from thick at sides to thin at front, the system achieves both adequate light blocking for optical isolation and sufficient light transmission for high emission efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces optical crosstalk while maintaining the brightness of the light-emitting elements by forming a light-shielding layer in intervals between the light-emitting elements, preventing brightness loss.
Implementation Method 1
thick black glues are made on a whole surface of the Mini-LED or Micro-LED chips to form black glues on a side surface of the Mini-LED or Micro-LED chips to block light emitted from the side surface
Implementation Method 2
a surface of the light-emitting part away from the driving substrate being in contact with to the buffer layer
Data Source
AI summary
The present disclosure provides a display device and a manufacturing method thereof. The display device includes: a driving substrate; light-emitting elements electrically connected to the driving substrate through a connecting part, and first intervals formed between two adjacent light-emitting elements; a light-shielding layer filled in the first intervals between the two adjacent light-emitting elements; and an encapsulation substrate disposed corresponding to the light-emitting elements. The encapsulation substrate includes a buffer layer, and a surface of a light-emitting part facing away from the driving substrate is in contact with to the buffer layer.