Mini LED Module Substrate Grooves for Protected Signal Lines
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Solution Overview
Problem
Mini LED backlight panels face issues with circuit line damage due to exposure, leading to malfunctions, and existing designs are not conducive to a light and thin structure.
Innovation Solution
A groove is incorporated in the substrate to house signal lines, preventing damage and maintaining a thin design, with signal lines embedded within these grooves to reduce resistance and voltage drop, allowing for a more efficient and durable light-emitting module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If circuit lines are exposed outside the substrate, then the signal line arrangement is simplified, but the signal lines are damaged by friction and collision resulting in breakage
Solution Approach 1:
The signal lines are embedded within grooves formed in the substrate, nesting the conductive traces inside the substrate structure rather than leaving them exposed on the surface. This protects the signal lines from external mechanical damage while maintaining electrical connectivity to the LED components.
2Reliability
If signal lines are embedded in grooves of the substrate, then the signal lines are protected from damage, but the design thickness of the light-emitting module increases
Solution Approach 1:
The substrate incorporates thin groove structures that provide protection for the signal lines while maintaining overall substrate thinness. The grooves are formed within the substrate thickness rather than adding external layers, allowing protected signal routing without significantly increasing the module's overall thickness.
3Ease of manufacture
If signal lines are arranged on the surface of the substrate, then the manufacturing process is simplified, but the signal lines are susceptible to abrasion and damage
Solution Approach 1:
The signal lines are nested within grooves in the substrate, protecting them from surface-level abrasion and mechanical damage. The grooves are formed using standard semiconductor fabrication techniques such as photolithography and etching, integrating the protective structure into the existing manufacturing process flow.
Data Source
AI summary
Disclosed are a light-emitting module and a display device. The light-emitting module includes a substrate, a first driving circuit layer and at least one first light-emitting unit group. At least one first groove is provided on a surface of the substrate. The first driving circuit layer is located on the substrate and includes at least one first signal line located in the first groove. The first light-emitting unit group is located on a side, where the first driving circuit layer is provided, of the substrate, and includes at least one first lamp bead, and the first lamp bead is connected in series on the first signal line. In the light-emitting module, the first signal line is arranged in the first groove of the substrate, which is equivalent to being embedded in the substrate.