Mini LED Display Panel Conductive Ink Bonding Without Trace Scratching
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Solution Overview
Problem
In the Mini LED bonding process, the dense patterns on the substrate lead to interlaced metal traces that are easily scratched, resulting in short circuits during the solder paste process.
Innovation Solution
A display panel is created using conductive ink comprising a prepolymer, monomer, conductive filler, and photoinitiator, which is patterned using photolithography to form conductive units that connect Mini LEDs to the substrate, thereby avoiding direct contact and reducing stress on the metal traces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If screen printing or roller stamping is used to apply solder paste, then the bonding process can be completed, but the metal traces are easily scratched and short circuits occur
Solution Approach 1:
The patent replaces the mechanical screen printing and roller stamping processes with a non-contact inkjet printing method. The inkjet printer deposits conductive ink directly onto the substrate without physical contact, eliminating the mechanical stress and scratching that occurs with traditional methods. This substitution of mechanical systems with a non-contact deposition method resolves the contradiction between ease of manufacture and metal trace integrity.
Solution Approach 2:
The patent introduces an intermediate layer of conductive ink that serves as a mediator between the solder paste and the metal traces. This conductive ink layer is deposited first and provides a protective interface, allowing subsequent solder paste application without direct contact with the underlying metal traces. The intermediary layer prevents mechanical damage while maintaining electrical conductivity.
2Ease of manufacture
If screen printing with large contact depth is used, then solder paste can be applied, but local stress concentration causes cracks in the insulating layer
Solution Approach 1:
The patent replaces the high-contact-pressure screen printing method with a non-contact inkjet printing system. The inkjet printer deposits conductive ink through a printhead that does not require significant downward pressure, eliminating the mechanical stress that causes cracks in the insulating layer. This maintains manufacturing capability while preserving substrate integrity.
3Productivity
If uneven scraper or roller speed is used, then the process can proceed, but solder paste thickness becomes uneven causing Mini LED misalignment
Solution Approach 1:
The patent replaces the mechanically-driven screen printing and roller stamping systems with a digitally-controlled inkjet printing system. The inkjet printer uses precisely controlled droplet ejection to deposit conductive ink with consistent thickness, eliminating the speed variations and thickness不均匀ity that occur with mechanical scrapers and rollers. This digital control method maintains productivity while significantly improving thickness uniformity and alignment precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method prevents scratches on the metal traces, reduces the risk of short circuits, and improves the transfer accuracy of Mini LEDs by using the viscosity of the conductive ink to securely attach the LEDs to the conductive units.
Implementation Method 1
the conductive ink comprises a prepolymer, a monomer, a conductive filler and a photoinitiator
Data Source
AI summary
Disclosed are a display panel and a manufacturing method thereof. The display panel comprises: a substrate, a plurality of conductive units and a plurality of Mini LEDs. A material of the conductive units is conductive ink, and the conductive ink comprises a prepolymer, a monomer, a conductive filler and a photoinitiator. The viscosity of the conductive ink itself is employed to adsorb the Mini LEDs to improve the transfer accuracy of the Mini LEDs and to prevent the weak adsorption between the Mini LEDs and the conductive units, which affects the electrical connection between the conductive units and the Mini LEDs.