Mini LED Light Source Module Single-Layer Wiring
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Solution Overview
Problem
Existing Mini LED backlight display devices face challenges with thick light source modules due to the integration of numerous Mini LEDs, which generates heat and is costly, with two or more layers of metal wiring causing short-circuit issues.
Innovation Solution
A light source module with a substrate arranged in an array manner, featuring two light-emitting groups with side-by-side light-emitting branches, and two driving chips centrally symmetrically disposed between the groups, utilizing single-layer-layout wiring to connect the chips and branches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If two or more layers of metal wiring are used to integrate Mini LEDs, then the light source module can be constructed, but the module thickness increases and short-circuit issues occur between metal layers
Solution Approach 1:
The patent extracts and eliminates the intermediate metal wiring layers from the traditional multi-layer structure. By directly mounting driving chips on the substrate and using wire bonding to connect LEDs to chip pads, the design removes unnecessary metal layers that caused thickness increase and short-circuit problems, while maintaining electrical connectivity through alternative connection paths.
Solution Approach 2:
The patent transitions from a vertical multi-layer stacking approach to a more planar distribution architecture. Driving chips are mounted directly on the substrate in a distributed arrangement, and electrical connections are established through wire bonding in the lateral dimension rather than through vertical metal layer stacking, effectively reducing the z-direction thickness.
2Ease of manufacture
If two or more layers of metal wiring are used to integrate Mini LEDs, then the light source module can be constructed, but short-circuit issues occur between different metal layers
Solution Approach 1:
The patent removes the problematic intermediate metal wiring layers that caused short-circuit issues. By eliminating these conductive layers, the design eliminates the source of short-circuits between metal layers while maintaining electrical connectivity through direct wire bonding connections between LED leads and driving chip pads.
Solution Approach 2:
The patent introduces wire bonding as an intermediary connection method between the LED leads and driving chip pads. This wire bonding technique provides reliable electrical connection without requiring direct contact between multiple metal layers, thereby eliminating short-circuit risks while maintaining manufacturing feasibility.
3Productivity
If a larger number of Mini LEDs are integrated, then the display performance is improved, but the heat generation increases
Solution Approach 1:
The patent divides the light source module into multiple independent driving chip units, each controlling a subset of LEDs. This segmentation allows heat to be distributed across multiple smaller heat sources rather than concentrated in a single large array, improving thermal management while maintaining high display performance through parallel operation of multiple chip-LED groups.
Data Source
AI summary
A light source module and a display device include a substrate configured to have a plurality of light-emitting regions arranged in an array manner, each light-emitting region is provided with two light-emitting groups, each light-emitting group includes a plurality of light-emitting branches arranged side by side, and two driving chips are disposed in parallel between the two light-emitting groups; and single-layer layout wiring arranged on the substrate, wherein the single-layer layout wiring couples the driving chips within the light-emitting regions to each other and electrically connects each of the driving chips to the light-emitting branches within one of the light-emitting groups.