Mini LED Package Structure With Reflective Colloid for Light Guide Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Mini light-emitting diode packages emit light inefficiently due to the inability to effectively couple light from all sides into a light guide plate, resulting in poor light coupling efficiency when used in side-lit displays.
Innovation Solution
A light-emitting diode package structure that includes a driving substrate with mini light-emitting diodes and a wavelength conversion layer, covered by a reflective colloid to focus light emission in a specific direction, increasing forward light emission and directivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If mini light-emitting diode packages emit light from five sides, then the light emission coverage is increased, but the light coupling efficiency into light guide plate deteriorates
Solution Approach 1:
The light-emitting structure is segmented into distinct functional zones: a first light-emitting region with light-emitting units oriented toward the light guide plate, and a second light-emitting region with light-emitting units oriented in other directions. This segmentation allows different portions of the structure to serve different purposes, with the first region optimized for efficient light coupling into the light guide plate while the second region provides additional light emission coverage.
Solution Approach 2:
Different regions of the light-emitting structure are assigned different local qualities and orientations. The light-emitting units in the first region are positioned and oriented to maximize light coupling efficiency into the light guide plate, while units in the second region are oriented to provide supplemental light emission. This local differentiation optimizes overall system performance by matching light emission characteristics to specific functional requirements of different regions.
2Quantity of substance
If mini light-emitting diode chip size is reduced to 0.1 mm to 0.2 mm, then the packaging density is increased, but the ease of individual packaging and assembly deteriorates
Solution Approach 1:
Multiple mini light-emitting diode chips are merged into integrated light-emitting units that are pre-assembled with supporting structures. These integrated units are then treated as single assembly components during the packaging process. This merging approach maintains high packaging density by utilizing small chip sizes while simplifying the manufacturing process by reducing the number of discrete assembly steps required for handling and positioning individual chips.
Solution Approach 2:
The structure employs a nested arrangement where mini light-emitting diode chips are positioned within cup shells that are integrated into a lead frame structure. The cup shells nest the chips in precise positions, and multiple such nested units are then arranged within the overall package. This nesting approach enables high-density packaging of tiny chips while maintaining ease of manufacture through standardized nested modules.
3Illumination intensity
If light is emitted from four sides around the front side, then the overall light output is increased, but the directivity and focused light emission deteriorates
Solution Approach 1:
The light-emitting structure is divided into a primary light-emitting region that directs light forward toward the light guide plate, and secondary light-emitting regions that emit light in other directions. This segmentation ensures that the majority of light emission is focused in the desired direction for optimal light guide plate coupling, while secondary regions provide additional overall light output without compromising the directivity of the primary emission path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances light emission in the forward direction, improving light coupling efficiency and brightness performance when coupled with a light guide plate, thereby addressing the inefficiencies of existing mini light-emitting diode packages.
Implementation Method 1
The reflective colloid covers a periphery of the light-emitting unit and the driving substrate. The light-emitting unit is suitable for emitting a light, and the reflective colloid is suitable for reflecting the light so as to focus on a light-emitting direction.
Data Source
AI summary
A light-emitting diode package structure includes a driving substrate, at least one light-emitting unit, and a reflective colloid. The driving substrate has a surface. The light-emitting unit includes at least one mini light-emitting diode and at least one wavelength conversion layer. The mini light-emitting diode is disposed on the surface of the driving substrate and electrically connected to the driving substrate. The wavelength conversion layer covers the mini light-emitting diode. The reflective colloid covers a periphery of the light-emitting unit and the driving substrate. The light-emitting unit is suitable for emitting a light, and the reflective colloid is suitable for reflecting the light so as to focus on a light-emitting direction.