Mini-LED Backlight Scan Line Layout for Lower Driver Chip Count
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Solution Overview
Problem
Conventional mini-LED backlight modules using glass substrates face challenges with high manufacturing costs due to the significant consumption of micro ICs and limited scalability, while PCB substrates suffer from warping and constrained line precision.
Innovation Solution
A mini-LED backlight module design utilizing a plurality of scan line sets, each comprising multiple scan lines connected to mini-LED partitions, and source electrode chips connected to multiple backlight groups via output channels, allowing simultaneous scanning and driving of multiple partitions, reducing the number of required source electrode chips by a factor of N.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If micro IC driving method is used for glass substrate mini-LEDs, then driving capability and control precision are improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent merges multiple scan lines into a single scan line by connecting them in parallel, allowing one scan line to simultaneously drive multiple mini-LEDs in different backlight groups. This consolidation reduces the total number of scan lines needed while maintaining the ability to independently control each mini-LED through the source electrode chip, thereby reducing manufacturing complexity and cost while preserving control precision.
Solution Approach 2:
The scan line is designed to serve multiple functions by simultaneously connecting to and driving mini-LEDs across multiple backlight groups. This multi-functional scan line structure allows a single scan line to replace what would traditionally require multiple separate scan lines, reducing the overall component count and manufacturing cost while maintaining full control capability.
2Ease of manufacture
If conventional PCB substrates are used, then manufacturing cost is reduced, but structural stability and line precision deteriorate due to warping and expansion
Solution Approach 1:
The patent changes the substrate material parameter from conventional PCB to glass substrate. This material substitution fundamentally alters the thermal and mechanical properties of the substrate, eliminating warping and expansion issues while providing excellent flatness and heat dissipation performance, thereby achieving both structural stability and manufacturing feasibility.
3Ease of manufacture
If the number of source electrode chips is reduced by factor of N, then manufacturing cost decreases, but control range and driving capability must be maintained
Solution Approach 1:
The patent combines multiple scan lines into one consolidated scan line that simultaneously drives mini-LEDs across N different backlight groups. This merging approach allows a single source electrode chip to control multiple backlight groups through the unified scan line, reducing the number of source electrode chips needed while maintaining full control range and adaptability through intelligent signal distribution.
Solution Approach 2:
The patent extends the control capability from a single backlight group to multiple backlight groups by adding a spatial dimension to the scan line connectivity. The scan line traverses across multiple backlight groups simultaneously, creating a multi-dimensional control structure that increases control range without proportionally increasing the number of source electrode chips.
Data Source
AI summary
The present application provides a mini-LED backlight module, a driving method thereof, and a display device thereof that dispose a plurality of scan line sets. Each of the scan line sets includes a number of M of scan lines. ith ones of the scan lines in the different ones of the scan line sets are connected to one another, and the ith ones of the scan lines in the different ones of the scan line sets are connected to the ith ones of the mini-LED partitions of the backlight groups respectively. Therefore, a number of the source electrode chips is reduced, which drastically decreases a manufacturing cost of the mini-LED backlight module.