Mini LED Conductive Ink Layout to Prevent Trace Scratching
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Solution Overview
Problem
In the Mini LED bonding process, metal traces are easily scratched during the solder paste application, leading to short circuits due to direct contact methods like screen printing and roller stamping, which cause local stress concentration and uneven solder paste thickness, resulting in placement errors and potential shifts of Mini LEDs.
Innovation Solution
A display panel is created using conductive ink comprising a prepolymer, monomer, conductive filler, and photoinitiator, applied through photolithography to form conductive units on a substrate, allowing for precise electrical connection between Mini LEDs and conductive elements, with controlled viscosity to improve transfer accuracy and prevent weak adsorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screen printing or roller stamping is used to apply solder paste, then electrical connection between Mini LEDs and substrate is achieved, but metal traces are easily scratched and short circuits occur
Solution Approach 1:
The patent replaces the mechanical screen printing and roller stamping processes with a non-contact inkjet printing method to apply conductive paste. This eliminates the physical contact that causes metal trace scratching while maintaining the electrical connection function between Mini LEDs and the substrate.
Solution Approach 2:
The patent changes the material composition parameters of the conductive paste, using a specifically formulated ink containing conductive particles suspended in a carrier solution. This allows for precise control of paste thickness and composition without mechanical pressure, preventing metal trace damage while ensuring reliable electrical connections.
2Ease of manufacture
If screen printing with large contact depth is used, then solder paste application is achieved, but local stress concentration causes cracks in insulating layer
Solution Approach 1:
The patent replaces mechanical screen printing with inkjet printing technology that deposits conductive paste without physical contact or pressure. This eliminates the large contact depth and associated stress concentration that causes insulating layer cracks, while maintaining manufacturing capability.
Solution Approach 2:
The patent introduces a liquid carrier solution as an intermediary medium to deliver conductive particles to the substrate. This liquid medium allows for precise paste placement without mechanical pressure, preventing insulating layer damage while achieving the desired conductive pattern.
3Reliability
If direct contact methods are used for solder paste application, then electrical connection is achieved, but uneven scraper speed causes uneven solder paste thickness
Solution Approach 1:
The patent replaces mechanical scraper-based methods with a digitally controlled inkjet printing system. This allows for precise control of paste deposition parameters including speed, volume, and positioning, ensuring uniform thickness without the variability inherent in mechanical scraper systems.
Solution Approach 2:
The patent employs a dynamic, programmable inkjet printing process that can adjust deposition parameters in real-time based on digital patterns. This dynamic control ensures consistent paste thickness and positioning, eliminating the unevenness caused by mechanical scraper speed variations.
4Reliability
If thick solder paste is used, then electrical connection is achieved, but Mini LED shifts during placement
Solution Approach 1:
The patent changes the material parameters of the conductive paste by using a viscous ink formulation with specific particle concentration and carrier fluid properties. This optimized composition provides adequate electrical connection with minimal thickness, preventing Mini LED displacement during placement while maintaining connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents metal trace scratches and short circuits by forming conductive units with controlled gaps, enhancing the accuracy and reliability of Mini LED placement and electrical connections, thus improving the manufacturing process.
Implementation Method 1
the conductive ink comprises a prepolymer, a monomer, a conductive filler and a photoinitiator
Data Source
AI summary
Disclosed are a display panel and a manufacturing method thereof. The display panel comprises: a substrate, a plurality of conductive units and a plurality of Mini LEDs. A material of the conductive units is conductive ink, and the conductive ink comprises a prepolymer, a monomer, a conductive filler and a photoinitiator. The viscosity of the conductive ink itself is employed to adsorb the Mini LEDs to improve the transfer accuracy of the Mini LEDs and to prevent the weak adsorption between the Mini LEDs and the conductive units, which affects the electrical connection between the conductive units and the Mini LEDs.