Mini-LED Array Water Jet Transfer for Precise Chip Ejection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current Mini-LED chip transfer methods, such as laser transfer, vacuum suction, and mechanical pin-ejector transfer, face challenges with high costs, low efficiency, precision issues, and pose deviations during chip expansion on the blue membrane, necessitating a more efficient and precise transfer technique.
Innovation Solution
The implementation of an array water jet-based ejection method using a device with a planar motion platform, vision camera, array water jet-type ejection unit, Z-axis motion platform, blue membrane, and transfer substrate, where Mini-LED chips are bonded to the blue membrane and ejected using a water jet array to improve transfer efficiency and precision, reducing pose deviations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If mechanical pin-ejector transfer method is used, then chip transfer can be performed, but transfer efficiency is poor and device wear increases due to frequent start and stop
Solution Approach 1:
The patent uses a water jet ejection device to transfer Mini-LED chips. The water jet system employs hydraulic principles to propel chips from the blue membrane to the transfer substrate without mechanical contact, eliminating the wear and precision issues associated with mechanical pin-ejectors while maintaining high transfer efficiency through continuous operation.
2Measurement precision
If vacuum suction transfer method is used, then individual chip pickup and release can be achieved, but transfer efficiency is poor due to independent processing of each chip
Solution Approach 1:
The patent merges multiple chip transfer operations into a single water jet ejection action. Instead of picking and placing chips individually as in vacuum suction methods, the water jet system simultaneously propels arrays of Mini-LED chips from the blue membrane to the transfer substrate in one operation, dramatically improving transfer efficiency while maintaining precision through vision system guidance.
3Manufacturing precision
If laser transfer method is used, then high precision chip transfer can be achieved, but cost increases significantly due to high requirements for materials, lasers, and environmental conditions
Solution Approach 1:
The patent replaces the complex laser transfer system with a water jet ejection system. Instead of using lasers to heat and transfer chips, which requires expensive equipment and controlled environmental conditions, the water jet method uses hydraulic propulsion with simpler equipment, reducing manufacturing costs while achieving comparable precision through vision system feedback and control.
4Ease of operation
If mechanical arm with cantilever structure is used, then chip transfer can be performed, but vibration occurs during transfer and packaging process
Solution Approach 1:
The patent uses water jet ejection to transfer chips without mechanical arms or cantilever structures. The hydraulic propulsion system operates from a fixed position, eliminating the vibrations inherent in mechanical arm systems while maintaining operational capability through directed water jet propulsion and vision-guided positioning.
5Adaptability or versatility
If spacing expansion of Mini-LED chips on blue membrane is performed, then chip arrangement can be adjusted, but pose deviations occur during expansion
Solution Approach 1:
The patent employs a vision system to detect the actual positions and orientations of Mini-LED chips on the blue membrane before water jet ejection. This feedback information is used to calculate compensation values that correct for pose deviations caused by spacing expansion, ensuring precise chip placement on the transfer substrate despite variations in chip positions during the expansion process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The array water jet-based ejection method enhances transfer yield and precision by minimizing impact on the blue membrane and chips, ensuring uniform ejection conditions for Mini-LEDs, and allows for fine adjustments to address transfer errors, thereby improving overall chip transfer efficiency and reducing pose deviations.
Implementation Method 1
an array water jet-type ejection unit comprises a water jet channel and a through-hole array
Implementation Method 2
ejecting, by the array water jet-type ejection unit, a water jet array to drive a first group of Mini-LED chips among the plurality of Mini-LED chips and the blue membrane to be peeled off to the transfer substrate
Data Source
AI summary
A device for mass transfer of Mini-LEDs based on array water jet-based ejection, including a planar motion platform, a vision camera, an array water jet-type ejection unit, a Z-axis motion platform, a blue membrane, an operation platform and a transfer substrate. The vision camera and the array water jet-type ejection unit are provided on a side of the planar motion platform. The array water jet-type ejection unit includes a water jet channel and a through-hole array. The Z-axis motion platform is provided at a side of the planar motion platform near the vision camera, and is configured for placement of the blue membrane. Multiple Mini-LED chips are bonded to the blue membrane. The operation platform is spacedly provided at a side of the Z-axis motion platform away from the planar motion platform.