Mini LED Light Source Module With Single-Layer Wiring Layout

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Solution Overview

Problem

Existing Mini LED backlight display devices face challenges with thick light source modules due to the need for a large number of Mini LEDs, which generates heat and is costly due to multi-layer metal wiring that is prone to short-circuits.

Innovation Solution

A light source module with a substrate arranged in an array manner, featuring two light-emitting groups with side-by-side light-emitting branches, and two driving chips centrally symmetrically arranged between the groups, utilizing single-layer-layout wiring to connect the chips and branches efficiently.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a larger number of Mini LEDs are integrated to achieve better display performance, then the display quality is improved, but the thickness of the light source module increases and heat generation increases

Engineering Contradiction:
Improvedisplay qualityVSAvoidthickness of light source module
Core Design Contradiction:
Illumination intensityVSLength of stationary object

Solution Approach 1:

The patent segments the light source module into multiple independent light-emitting regions, each driven by separate driving chips. This segmentation allows for better heat distribution and thinner overall structure while maintaining high display quality through the collective arrangement of multiple Mini LEDs across different regions.

Inventive Principle:
Principle #1Segmentation

2Reliability

If two or more layers of metal wiring are used to connect driving chips and light-emitting branches, then the electrical connections are improved, but the risk of short-circuit increases and manufacturing cost increases

Engineering Contradiction:
Improveelectrical connectionsVSAvoidmetal wiring structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the multi-layer metal wiring structure, replacing it with a simplified single-layer wiring design. This extraction removes the source of short-circuits between layers while maintaining effective electrical connections between driving chips and light-emitting branches through optimized trace routing on the substrate.

Inventive Principle:
Principle #2Taking out (Extraction)

3Reliability

If two or more layers of metal wiring are used to connect driving chips and light-emitting branches, then the electrical connections are improved, but the manufacturing cost increases

Engineering Contradiction:
Improveelectrical connectionsVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent removes the complex multi-layer metal wiring structure, extracting only the essential single-layer wiring needed for electrical connections. This simplification dramatically reduces manufacturing complexity and cost while maintaining sufficient electrical connectivity through optimized trace design and direct routing patterns.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables thinner, cost-effective, and reliable light source modules by avoiding short-circuits between metal layers and reducing production costs while improving product yield.

Implementation Method 1

single-layer-layout wiring arranged on the substrate, wherein the single-layer-layout wiring couples the driving chips within the light-emitting regions to each other and electrically connects each of the driving chips to the light-emitting branches within one of the emitting groups

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

each of the light-emitting branches includes one sub-millimeter light-emitting diode

Methodology Applied
Scientific EffectLight-emitting diode effect: Light Emitting Diode

Implementation Method 3

each of the light-emitting branches includes one sub-millimeter light-emitting diode

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Data Source

PatentUS12237363B2Light source module and display device
Publication Date: 2025.02.25 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
  • US12237363B2 patent drawing
  • US12237363B2 patent drawing
  • US12237363B2 patent drawing

AI summary

A light source module and a display device include a substrate configured to have a plurality of light-emitting regions arranged in an array manner, each light-emitting region is provided with two light-emitting groups, each light-emitting group includes a plurality of light-emitting branches arranged side by side, and two driving chips are disposed in parallel between the two light-emitting groups; and single-layer layout wiring arranged on the substrate, wherein the single-layer layout wiring couples the driving chips within the light-emitting regions to each other and electrically connects each of the driving chips to the light-emitting branches within one of the light-emitting groups.