Miniaturized Wet Etching Automation for Small-Wafer Research
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Solution Overview
Problem
Current semiconductor manufacturing equipment is not suitable for scientific research due to its large size, high chemical solution consumption, incompatibility with small-size wafers, and inflexibility in process control, posing safety risks and inefficiencies in manual operations.
Innovation Solution
A miniaturized, fully automatic wet etching system with integrated chemical solution modules, a robot module, and a control system that simulates human operation, enabling flexible process control and reducing chemical solution use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If conventional enterprise-level wet-processing equipment is used, then automation is achieved, but equipment size becomes large occupying excessive clean room space
Solution Approach 1:
The equipment is divided into modular functional units including a robot system with multiple arms, a chemical solution supply system with separate tanks, and a machine system with distinct working spaces. This segmentation allows compact arrangement while maintaining full automation capabilities, resolving the contradiction between automation and equipment size.
Solution Approach 2:
The robot module is positioned within the working space of the machine system, and chemical solution tanks are integrated into the machine chamber. This nested arrangement allows components to occupy shared spatial volumes, significantly reducing the overall equipment footprint while preserving automation functions.
2Extent of automation
If centralized chemical solution supply is implemented, then automation is improved, but chemical solution consumption increases greatly
Solution Approach 1:
The chemical solution supply mechanism provides precise controlled dosing rather than continuous or excessive supply. The system supplies chemical solutions in optimized quantities matching actual processing needs, reducing waste while maintaining automated operation. This partial action approach prevents over-supply and minimizes chemical consumption.
Solution Approach 2:
The control system monitors processing parameters and chemical solution usage, adjusting supply rates based on real-time feedback. This closed-loop control ensures chemical solutions are supplied only when and in the amounts needed for etching operations, preventing excessive consumption while maintaining automation.
3Adaptability or versatility
If conventional wet-processing equipment is used, then large-size semiconductors can be processed, but compatibility with small-size semiconductors is lost
Solution Approach 1:
The robot system features dynamically adjustable end effectors and positioning systems that can adapt to different wafer sizes from 1cm to 12 inches. The chemical solution supply mechanism also dynamically adjusts flow rates and distribution patterns based on detected wafer dimensions, maintaining processing precision across varying sizes through real-time adaptation.
Solution Approach 2:
The equipment is designed with universal components that can handle multiple wafer sizes using the same mechanical and chemical processing systems. The robot arms, chemical solution tanks, and etching chambers are configured to accommodate both small research wafers and large production wafers, achieving versatility without sacrificing precision for either size category.
4Adaptability or versatility
If manual operation is used for research, then flexibility is maintained, but safety risks increase due to handling dangerous chemical solutions
Solution Approach 1:
The robot system acts as an intermediary between the operator and dangerous chemical solutions, performing all handling operations remotely. The robot arms manipulate wafers and position them in chemical solution tanks without human contact, while the chemical solution supply mechanism delivers reagents automatically. This intermediary approach eliminates direct human exposure to harmful chemicals while preserving process flexibility through programmable operations.
Solution Approach 2:
The system performs self-service operations including automatic chemical solution dispensing, wafer handling, and process monitoring without requiring manual intervention. The control system manages the entire etching process autonomously, reducing safety risks by eliminating the need for researchers to directly handle dangerous chemical solutions while maintaining adaptable process control.
5Adaptability or versatility
If manual chemical solution formulation is performed, then research flexibility is maintained, but research efficiency and process stability decrease
Solution Approach 1:
Manual chemical solution formulation and handling operations are replaced by an automated chemical solution supply system with electronic control. The system uses automated dispensing mechanisms and control algorithms to prepare and deliver chemical solutions, replacing manual mechanical operations. This substitution maintains research flexibility through programmable formulations while dramatically improving efficiency and process stability through consistent automated execution.
Solution Approach 2:
The chemical solution supply mechanism enables dynamic adjustment of solution parameters including concentration, flow rate, temperature, and timing through electronic control. Researchers can programmatically change these parameters to optimize different experimental conditions, maintaining flexibility while achieving superior efficiency and stability compared to manual formulation through precise parameter control.
Data Source
AI summary
A research wet etching fully automatic system includes: a machine system for providing a miniaturized machine chamber; an etching system including chemical solution modules in the miniaturized machine chamber, the chemical solution module including a chemical solution tank and a chemical solution supply mechanism for supplying a chemical solution to the chemical solution tank according to a preset chemical solution supply strategy and controlling an etching environment in the chemical solution tank; a feeding system for implementing automatic transportation of a workpiece; a robot system including a robot module and a vision module communicatively connected thereto; and a control system. The robot module is internally arranged at a top of the working space, and is configured for gripping the workpiece according to image information fed back by the vision module, and placing the workpiece into the chemical solution tank for etching according to a preset etching strategy.