Miniaturized Coil Component Electrode Structure Against Plating Bleeding
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Solution Overview
Problem
In the miniaturization of coil components, plating bleeding during the formation of external electrodes can lead to unwanted electrode extension beyond the target location, compromising connectivity between the coil portion and the external electrode.
Innovation Solution
A coil component design featuring a body with a support substrate, a coil portion, and insulating layers, where the external electrodes are formed using a plating process with a first insulating layer acting as a plating resist, and a second insulating layer covering the connection portions to prevent short-circuiting, while maintaining connectivity and reducing plating bleeding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a plating process is used to form external electrodes for miniaturization, then the coil component size is reduced, but plating bleeding causes the external electrode to extend to unwanted locations
Solution Approach 1:
A plating resist layer is formed on the coil component body before the plating process to define the precise formation location of external electrodes. The plating resist layer is applied in advance to mask areas where plating should not occur, preventing plating bleeding before it happens. After plating, the plating resist layer is removed to reveal the precisely formed external electrodes at the intended locations only.
Solution Approach 2:
The plating resist layer acts as an intermediary substance between the plating solution and the coil component body. It temporarily occupies the spaces where plating should not occur, mediating the interaction between the plating process and the component geometry. This intermediary layer allows the plating process to proceed while preventing metal deposition in unwanted areas, thus controlling electrode positioning accuracy during miniaturization.
2Manufacturing precision
If the external electrode is constrained to prevent plating bleeding, then positioning accuracy is improved, but connectivity between the coil portion and the external electrode may be compromised
Solution Approach 1:
The plating resist layer is not uniformly applied across the entire coil component body, but rather with spatially varying properties. It is selectively removed or not applied in specific regions where electrode connectivity is required, while maintaining full coverage in areas where plating bleeding must be prevented. This local differentiation allows simultaneous achievement of precise electrode positioning and reliable connectivity where needed.
Solution Approach 2:
The plating resist layer is segmented into distinct regions: areas where it remains to prevent plating bleeding, and areas where it is removed to allow electrode formation and connectivity. This segmentation of the resist layer's function across different spatial zones enables the external electrode to be precisely positioned while maintaining necessary electrical connections to the coil portion through the lead-out pattern.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces plating bleeding and maintains connectivity between the coil portion and the external electrodes, ensuring reliable operation and miniaturization of coil components.
Implementation Method 1
an first insulating layer disposed on the one end surface of the body and having one region and the other regions spaced apart from each other in the other direction crossing the one direction, an external electrode having a connection portion, disposed between the one region and the other region to be connected to the lead-out pattern
Implementation Method 2
a second insulating layer disposed on the one end surface of the body to cover the first insulating layer and the connection portion
Data Source
AI summary
A coil component includes a body having one surface and the other surface, opposing each other in one direction, and one end surface connecting the one surface and the other surface to each other, a support substrate embedded in the body, a coil portion disposed on the support substrate and including a lead-out pattern exposed from the one end surface, a first insulating layer disposed on the one end surface and having one region and the other regions spaced apart from each other in the other direction crossing the one direction, an external electrode having a connection portion, disposed between the one region and the other region to be connected to the lead-out pattern, and an extension portion extending from the connection portion to the one surface, and a second insulating layer disposed on the one end surface to cover the first insulating layer and the connection portion.