Miniature Fluid Actuator Structure With Integrated Chamber Alignment
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Solution Overview
Problem
Conventional miniature fluid actuators face challenges in miniaturization and efficiency due to misalignment and depth errors during chip combination, leading to defective products and reduced performance.
Innovation Solution
A miniature fluid actuator is produced using a semiconductor process, specifically a one-poly-six-metal (1P6M) or two-poly-four-metal (2P4M) process, incorporating a substrate, chamber layer, carrying layer, and piezoelectric assembly, which accurately defines the volumes and positions of the fluid chambers through precise metal layer deposition and etching, eliminating the need for chip lamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional miniature fluid actuators are formed by sequentially stacking and combining multiple chips through etching processes, then the device can be miniaturized, but misalignment and depth errors occur during chip combination, reducing manufacturing precision and efficiency
Solution Approach 1:
The patent merges multiple chips into a single integrated substrate, forming all fluid chambers (first chamber, second chamber, resonance chamber) and their interconnections directly within one substrate. This eliminates the need for sequential stacking and combining of multiple chips, thereby preventing misalignment and depth errors while achieving miniaturization.
2Volume of moving object
If multiple chips are combined to form the fluid actuator, then the device can be miniaturized, but the complexity of combining chips increases and leads to positioning errors
Solution Approach 1:
The patent combines multiple functional components (fluid chambers, resonance chamber, connecting channels, piezoelectric assembly) into a single integrated device structure formed on one substrate. This merging approach simplifies the overall device architecture by eliminating the need for separate chips and their complex assembly processes.
Solution Approach 2:
The patent performs preliminary formation of all chamber structures, connecting channels, and piezoelectric assemblies directly on the substrate during the manufacturing process. This preliminary integration ensures proper positioning and alignment are built-in from the start, eliminating the need for complex post-assembly positioning operations.
3Productivity
If conventional chip stacking methods are used, then the device can be assembled, but the transportation efficiency is greatly reduced due to misalignment of fluid-flowing chambers
Solution Approach 1:
The patent merges all fluid transport pathways and chambers into a single integrated substrate with precisely defined geometries. This ensures optimal fluid flow paths without misalignment, thereby maximizing transportation efficiency while eliminating the positioning errors inherent in multi-chip assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures accurate chamber formation and alignment, enhancing the transportation efficiency of the miniature fluid actuator and preventing defects, making it suitable for various industrial applications.
Implementation Method 1
The piezoelectric assembly is formed on the vibration region
Implementation Method 2
The resonance layer has a central aperture. The central aperture is in communication with the first chamber
Data Source
AI summary
A miniature fluid actuator is disclosed and includes a substrate, a chamber layer, a carrying layer and a piezoelectric assembly. The substrate has an inlet. The chamber layer is formed on the substrate and includes a first chamber in communication with the inlet, a resonance layer and a second chamber. The resonance layer has a central aperture in communication between the first chamber and the second chamber. The carrying layer includes a fixed region formed on the chamber layer, a vibration region, a connection portion and a vacant. The vibration region is located at a center of the fixed region and corresponding to the second chamber. The connection portion is connected between the fixed region and the vibration region. The vacant is formed among the fixed region, the vibration region and the connection portion. The piezoelectric assembly is formed on the vibration region.