Miniature Microwave Component with Contactless Access Ports
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Solution Overview
Problem
The high cost and complexity of producing millimetric-frequency electronic components, particularly due to expensive semiconductor materials and difficult high-frequency interconnections, limit the affordability and scalability of automobile radar systems.
Innovation Solution
A miniature microwave component with a contactless electromagnetic access port and subharmonic access port, using a metal base with an aperture for electromagnetic coupling, and surface mounting techniques to reduce production costs and simplify fabrication, compatible with existing high-volume manufacturing technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire-bonding is used to connect chips to hybrid substrate at millimetric frequencies, then reliable high-frequency signal transmission is achieved, but production cost increases and manufacturing complexity increases
Solution Approach 1:
The patent extracts the wire-bonding step from the manufacturing process entirely. Instead of using wire-bonding to connect chips to substrate, the invention uses direct surface mounting of chips with integrated contactless access ports that couple electromagnetically with the substrate, eliminating the need for wire bonds while maintaining signal transmission capability.
Solution Approach 2:
The patent replaces the mechanical wire-bonding connection system with an electromagnetic coupling system. The contactless access ports on the chips couple with corresponding ports in the substrate through electromagnetic fields, substituting the mechanical wire-bonding process with a non-contact electromagnetic interaction that is both reliable for high frequencies and easier to manufacture.
2Adaptability or versatility
If multiple MMIC chips are mounted on hybrid substrate, then complex microwave functions are achieved, but manufacturing complexity and production cost increase
Solution Approach 1:
The patent merges multiple functions into fewer chips by integrating contactless access ports directly into the MMIC chip structure. This allows multiple chips to be surface-mounted on the substrate without requiring complex wire-bonding interconnections, as each chip independently couples with the substrate through its integrated access ports, simplifying the overall manufacturing process.
Solution Approach 2:
The substrate is designed with universal contactless access port structures that can interface with multiple different types of MMIC chips performing various microwave functions. This universal interface design allows the same substrate to support diverse chip configurations without requiring custom interconnection schemes, reducing manufacturing complexity while maintaining functional versatility.
3Ease of manufacture
If contactless electromagnetic access ports are used for signal transmission, then wire-bonding is eliminated and production cost decreases, but electromagnetic coupling efficiency must be maintained at millimetric frequencies
Solution Approach 1:
The patent optimizes the geometric parameters of the contactless access ports (such as aperture size, shape, and positioning) to maximize electromagnetic coupling efficiency at millimetric frequencies. By carefully adjusting these parameters, the design achieves reliable signal transmission through electromagnetic coupling without requiring wire-bonding, thereby reducing production cost while maintaining coupling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces fabrication costs, eliminates the need for wire-bonding at millimetric frequencies, and enhances reproducibility by leveraging mass-production technologies and surface mounting techniques, while maintaining effective signal transmission above 45 GHz.
Implementation Method 1
a contactless microwave access port, by electromagnetic coupling at the aperture in the base, ensuring transmission of coupling signals at a working frequency F0
Data Source
AI summary
The invention relates to a miniature microwave component having: a microwave chip (18, 60, 140) encapsulated in an individual package (61) for surface mounting. A metal base (80) mounts the chip in the package via its rear face. The base has an aperture (82). At least two access ports are provided for the communication of electrical signals between the inside and the outside of the package. A contactless microwave access port (62), by electromagnetic coupling at the aperture in the base, ensures transmission of coupling signals at a working frequency F0. A subharmonic access port (110) via a contact, inputs, into the integrated circuit, a subharmonic frequency F0/n of the working frequency F0. The chip includes, among its electrical conductors, a coupling electrical conductor (96) connected to the electronic elements of the chip. The coupling conductor is placed at the contactless microwave access port (62) in order to transmit microwave signals by electromagnetic coupling at the working frequency F0.