Miniature Refrigerant Cooling for Processor Heat Dissipation
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Solution Overview
Problem
Existing cooling systems for electronic apparatus, such as computer processors, face limitations in miniaturization and heat transfer efficiency, particularly in small spaces where space and connectivity are restricted, due to increasing power and heat dissipation from semiconductor devices.
Innovation Solution
A self-contained cooling system utilizing a miniaturized compression/expansion cycle, also known as the Carnot cycle, with a compressor, condenser, and evaporator integrated within a volume, mounted directly on a semiconductor device, employing a trilobal rotor driven by electromagnetic coils to efficiently transfer heat through a refrigerant fluid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional heat sinks with natural or forced convection air systems are used, then heat dissipation is achieved, but the system size and space requirements increase
Solution Approach 1:
The patent employs phase transitions of refrigerant material between liquid and vapor states to transfer heat. The refrigerant evaporates at the evaporator to absorb heat from the semiconductor device, then condenses at the condenser to release heat, enabling efficient heat dissipation in a compact volume through latent heat utilization.
Solution Approach 2:
The invention uses a closed-loop refrigeration system with refrigerant fluid circulation through compression, condensation, expansion, and evaporation processes. This pneumatic-hydraulic cycle enables high-density heat transfer in a miniaturized configuration compared to air-based convection systems.
2Loss of energy
If heat sinks with forced convection air systems are used, then heat transfer efficiency improves, but device complexity and space requirements increase
Solution Approach 1:
The patent integrates the compressor, condenser, evaporator, and expansion device into a single miniaturized refrigeration system that can be mounted directly on the semiconductor device. This merging of components eliminates the need for separate heat sink assemblies and external refrigeration systems, reducing overall device complexity while maintaining high heat transfer efficiency.
Solution Approach 2:
The refrigeration system is designed as a nested, self-contained unit where the evaporator contacts the semiconductor device directly, and the condenser is positioned to interface with the external environment. This nested configuration allows the entire refrigeration cycle to be housed within a volume consistent with mounting directly on the semiconductor device.
3Loss of energy
If circulated fluids such as water chilled by external refrigeration systems are used, then heat dissipation is achieved, but connectivity requirements and system volume increase
Solution Approach 1:
The refrigeration system is self-contained with all necessary components (compressor, condenser, evaporator, expansion device) integrated into a single unit that operates autonomously. The system requires no external refrigeration equipment, fluid supply lines, or complex connectivity infrastructure, as it uses a closed-loop refrigerant circulation system that serves itself.
4Volume of moving object
If miniaturization is pursued to accommodate space restrictions, then space requirements decrease, but heat transfer efficiency may deteriorate
Solution Approach 1:
The patent utilizes parameter changes in the refrigerant material during phase transitions (liquid to vapor and back) to achieve high heat transfer coefficients in a miniaturized system. The latent heat of vaporization and condensation provides intense heat transfer at constant temperature, enabling efficient heat dissipation despite the reduced system volume.
Solution Approach 2:
The evaporator is designed with direct contact with the semiconductor device surface, creating a localized high heat transfer zone where heat is absorbed from the heat-generating component. The condenser is positioned to maximize heat rejection to the external environment, optimizing local heat transfer quality throughout the miniaturized system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat transfer efficiency, effectively maintaining desirable temperatures for semiconductor chips by transferring heat from the chip to a heat sink, outperforming traditional methods like heat conducting grease, and is adaptable for use in compact electronic systems.
Implementation Method 1
the evaporator are all contained within a volume consistent with mounting directly on a semiconductor device such as a processor
Implementation Method 2
use compression/expansion cycles of a refrigerant material to move thermal energy from one location to another
Implementation Method 3
The compressor, condenser, and evaporator are all contained within a volume consistent with mounting directly on a semiconductor device
Implementation Method 4
transferred heat to the heat sink for dispersal to air
Implementation Method 5
employing a trilobal rotor driven by electromagnetic coils to efficiently transfer heat through a refrigerant fluid
Data Source
AI summary
A self contained cooling system which is amenable to miniaturization so as to accommodate space and connectivity restrictions implicit in computer and other electronics apparatus while enhancing heat transfer. In use, the cooling systems of this invention use compression/expansion cycles of a refrigerant material to move thermal energy from one location to another. The compressor, condenser, and evaporator are all contained within a volume consistent with mounting directly on a semiconductor device such as a processor.