Miniature Resistor Manufacturing via Slit Foil Segmentation
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Solution Overview
Problem
Conventional methods for manufacturing miniature resistors face issues such as increased thickness, imprecise resistance values, sticky packaging, and peeling of the supporting layer, which complicates the production process and increases costs.
Innovation Solution
A method involving a patterned foil sheet with slits and connecting regions, a resin film, protruding blocks, and encapsulating layers, where the resin film is formed on the bottom surface and the die cutting process separates individual resistor blanks, eliminating the need for a supporting sheet and enhancing structural strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a support sheet is disposed on the bottom surface of the plate to avoid deformation during die cutting, then the plate maintains structural stability, but the thickness of the miniature resistor increases and the supporting layer may peel off
Solution Approach 1:
The patent removes the support sheet from the manufacturing process entirely. Instead of adding a supporting layer to prevent deformation, the method uses a foil sheet with pre-formed slits that maintain structural integrity during die cutting without requiring any additional support structure.
Solution Approach 2:
The foil sheet is divided into multiple slits that create independent compartments for each resistor blank. These slits are spaced apart at intersections of longitudinal and transverse rows, providing structural support while allowing complete separation during die cutting without requiring a continuous support layer.
2Stability of the object's composition
If a support sheet is used to prevent deformation during die cutting, then the plate maintains its shape, but the resistance value precision deteriorates and packaging becomes problematic
Solution Approach 1:
The support sheet is completely removed from the process. The foil sheet's own structure, with its pattern of slits and connecting regions, provides sufficient stability during die cutting without interfering with resistance value precision or causing packaging issues.
Solution Approach 2:
The slits are pre-formed in the foil sheet before the die cutting process. This preliminary structuring ensures that the foil maintains its shape during subsequent processing steps while allowing precise resistance trimming and clean separation without the interference of a support layer.
3Productivity
If the die cutting process is performed on a plate with a support sheet, then individual resistor blanks can be separated, but the supporting layer peels off and causes technical issues
Solution Approach 1:
The support sheet is eliminated entirely. The foil sheet with its slit pattern provides inherent structural support that prevents peeling during die cutting, enabling reliable mass production without the adhesion problems associated with supporting layers.
Solution Approach 2:
The slits create discrete compartments that naturally separate during die cutting. The connecting regions at intersections provide just enough structural integrity to prevent peeling during processing, while allowing clean separation into individual resistor blanks for high-volume production.
4Productivity
If the slits are closely spaced to define multiple resistor blanks, then the manufacturing efficiency improves, but the structural strength of the foil sheet decreases
Solution Approach 1:
The foil sheet is segmented into multiple slits arranged in longitudinal and transverse rows, creating many resistor blanks per plate for high productivity. The slits are spaced apart at intersections to maintain structural strength while enabling complete separation during die cutting.
Solution Approach 2:
The spacing between slits varies by location: slits are closely spaced within rows to maximize the number of resistor blanks, but spaced apart at intersections of longitudinal and transverse rows to maintain local structural strength and prevent deformation during processing.
Data Source
AI summary
A method for manufacturing a miniature resistor includes the steps of: providing a foil sheet; forming intersecting rows of slits to define a patterned foil sheet having a matrix array of resistor blanks that are interconnected at intersections of the intersecting rows; forming a resin film on a bottom surface of the patterned foil sheet; forming a plurality of protruding blocks on each resistor blanks; forming an encapsulating layer on atop surface of each resistor blanks without covering outer surfaces of the protruding blocks; performing a die cutting process to obtain individual resistor blanks; and forming two external electrodes respectively on the protruding blocks and on two side surfaces of the individual resistor blanks to obtain the miniature resistor.