Miniature Semiconductor Packaging Without Substrate
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Solution Overview
Problem
Conventional packaging technologies for discrete semiconductor circuit components face limitations in volumetric utilization, handling reliability, and environmental compliance, with high costs due to the use of substrates and inefficient lead-frame packaging.
Innovation Solution
A miniature packaging method that eliminates the need for a physical substrate and lead-frame by fabricating core dices on a semiconductor substrate with metallization electrodes, forming end electrodes that connect to the core dices, and physically separating them for improved volumetric utilization and reduced costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional substrate-based packaging is used, then structural support is provided, but volumetric utilization is limited to about 7 percent and costs increase
Solution Approach 1:
The invention extracts and eliminates the substrate from the packaging structure, using only the core dice itself as the packaging body. This removes the unnecessary substrate layer that was occupying space without providing functional value, thereby achieving up to 50% volumetric utilization compared to the conventional 7%.
Solution Approach 2:
The invention merges the substrate function with the core dice by making the core dice itself serve as the packaging body. The core dice is directly bonded to the circuit board without an intermediate substrate, combining the support function and the circuit component into a single integrated structure.
2Reliability
If wire-bonding is used for electrical connection, then electrical connectivity is achieved, but fabrication costs increase due to gold-wire and bottlenecks
Solution Approach 1:
The invention replaces the mechanical wire-bonding process with direct metallization electrode bonding. Instead of using gold wires and wire-bonding equipment, the core dice is directly bonded to the circuit board through its own metallization electrodes, eliminating the need for wire-bonding infrastructure and reducing material costs.
3Strength
If lead-frame packaging is used, then structural support is provided, but volumetric utilization decreases and packaging procedure becomes complicated
Solution Approach 1:
The invention extracts and removes the lead-frame from the packaging structure, relying solely on the core dice itself to provide the necessary structural support and electrical connectivity. This eliminates the bulky lead-frame that was reducing volumetric utilization and complicating the packaging procedure.
4Ease of manufacture
If conventional packaging materials are used, then packaging functionality is achieved, but environmental regulation compliance becomes difficult
Solution Approach 1:
The invention extracts and eliminates harmful packaging materials such as substrates, lead-frames, and excessive encapsulants. By using only the essential core dice structure with minimal necessary materials, the packaging becomes more compatible with environmental regulations including RoHS and Halogen Free requirements.
Data Source
AI summary
A miniature packaging for a discrete circuit component that comprises a core dice for the circuit component fabricated on a semiconductor substrate. The core dice has at least a pair of metallization electrodes formed on the same or different surfaces of the semiconductor substrate. An end electrode covers a corresponding side surface of the core dice and electrically connects to a corresponding one of the pair of metallization electrodes. The end electrode extends toward the center of the core dice on both the top and bottom surface of the core dice.