Miniaturized Interposer Shield Layout for High-Speed Crosstalk
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing interposers face challenges in miniaturization while maintaining effective shielding against crosstalk, particularly for high-speed signals, as traditional methods increase the size of the interposer to reduce signal interference.
Innovation Solution
The development of a miniaturized interposer with integrated shields that are strategically placed between electrical contacts, using a thin shield plate with shield contacts extending from its edges, which are configured to deflect and shunt signals, thereby reducing crosstalk without significantly increasing the interposer's footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If shields are added between compliant contacts to reduce crosstalk, then signal interference is reduced, but the size of the interposer increases
Solution Approach 1:
The shield is nested within the existing interposer structure by placing it in a channel that extends between the top and bottom surfaces. The shield utilizes the vertical space already available in the interposer design, rather than expanding the horizontal footprint. This allows the shield to be integrated without significantly increasing the overall interposer size.
Solution Approach 2:
The solution transitions from a two-dimensional planar arrangement to a three-dimensional structure by introducing a vertical channel that houses the shield. The shield extends in the vertical dimension (z-axis) between the top and bottom surfaces, allowing crosstalk reduction without proportionally increasing the horizontal area.
2Area of stationary object
If the interposer is miniaturized, then the footprint is reduced, but effective shielding against crosstalk becomes difficult to maintain
Solution Approach 1:
The shield is nested within the existing interposer structure by placing it in a channel that extends between the top and bottom surfaces. The shield utilizes the vertical space already available in the interposer design, rather than expanding the horizontal footprint. This allows the shield to be integrated without significantly increasing the overall interposer size.
Solution Approach 2:
The shield is implemented as a thin plate structure that can be inserted into the channel. This thin-film approach provides effective electromagnetic shielding while occupying minimal space within the interposer volume, enabling miniaturization without sacrificing shielding effectiveness.
3Quantity of substance
If compliant contacts are positioned close to each other, then the interposer density increases, but crosstalk between contacts increases
Solution Approach 1:
The shield acts as an intermediary element positioned between the compliant contacts that carry high-speed signals. This intermediate structure provides electromagnetic isolation between adjacent contacts, allowing them to be positioned closer together while maintaining signal integrity and reducing crosstalk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes crosstalk between high-speed signals, achieving less than 6% far-end crosstalk over a frequency range of 1 to 15 GHz, while maintaining a compact design that supports high-speed signal transmission without degrading signal integrity.
Implementation Method 1
a shield disposed in the channel, the shield comprising a plurality of first shield contacts extending from a first edge of the shield, wherein the plurality of first shield contacts extend through the top surface of the insulative housing
Data Source
AI summary
A compact interposer with shields and multiple electrical contacts held in a housing. Each shield is compact, being disposed in a vertical plane perpendicular to the top and bottom surfaces of the housing and between two adjacent electrical contacts respectively on opposing sides of the shield. The shield includes a plurality of shield contacts extending above the top surface and/or below the bottom surface of the housing. During operation, the shield is configured to reduce crosstalk between high-speed signals carried in the electrical contacts on opposing sides of the shield. Optionally, when in a compressed state, the shield contact may be configured to contact the shield body to shunt a distal end of the shield contact. The shield body and shield contacts may be stamped from the same sheet of metal. The shield contacts may have properties that provide reliable operation of the interposer.


