Miniaturized Lens Module Layout With Overlapped PCB Components
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Solution Overview
Problem
The size of lens packaging modules increases with larger photosensitive chips due to the need for larger circuit boards to accommodate passive components and lens assemblies, limiting miniaturization.
Innovation Solution
A method involving a circuit board with a through hole and encapsulation portions to mount passive components and a photosensitive chip, where the encapsulation portions reduce contamination and light interference, allowing for a compact lens assembly configuration that overlaps with passive components, thereby minimizing the overall module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the photosensitive chip size is increased, then the imaging performance is improved, but the circuit board size must be increased to accommodate passive components and lens assembly
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration. Passive components are mounted on the front surface while the photosensitive chip and lens assembly are mounted on the rear surface of the circuit board, utilizing the vertical dimension to resolve the area conflict between imaging performance and board size
Solution Approach 2:
The circuit board is functionally segmented into two surfaces: the front surface for passive components and the rear surface for the photosensitive chip and lens assembly. This segmentation allows independent optimization of each surface's component layout, enabling compact overall design while maintaining large chip size for high imaging performance
2Ease of manufacture
If the circuit board size is increased to accommodate passive components and lens assembly, then all components can be properly mounted, but the overall lens packaging module size is increased
Solution Approach 1:
By utilizing both front and rear surfaces of the circuit board for component mounting, the patent effectively doubles the available mounting area without increasing the board's planar dimensions. This vertical utilization of space allows all components to be properly mounted while keeping the module compact
Solution Approach 2:
The lens assembly is positioned to overlap with the passive components in the vertical direction, creating a nested arrangement where components occupy overlapping spatial footprints. This nesting reduces the overall module volume by eliminating wasted space between components
3Device complexity
If traditional mounting methods are used without encapsulation portions, then the structure is simpler, but particle contamination and light interference increase
Solution Approach 1:
Encapsulation portions are introduced as intermediary elements between the circuit board components and the external environment. These encapsulation structures shield passive components and electrical connections from particle contamination while preventing stray light from reaching sensitive areas, thus eliminating harmful factors with minimal added complexity
Solution Approach 2:
The encapsulation portions are designed in advance to prevent particle accumulation and light interference before these harmful factors can affect component performance. By proactively blocking contamination paths and light leakage routes at the design stage, the patent prevents rather than remedies these issues
Data Source
AI summary
A lens packaging module with miniaturized size, and an electronic device carrying it, includes a circuit board, a passive component, an encapsulation portion, a photosensitive chip, and a lens assembly. The encapsulation portion is provided on the circuit board to cover the passive component, and the lens assembly is formed on the encapsulation portion. Thus, the area occupied by the passive component on the circuit board overlaps at least partially with the area occupied by the lens assembly, so that the overall size of the lens packaging module of the present application can be reduced. A preparation method of the lens packaging module is also provided.