Miniaturized Optical Sensor Package With Integrated Light Blocking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional optical sensor packages are too large to be adapted for movable or wearable electronic devices due to the separate arrangement of the light source and light blocking cover on a printed circuit board, which results in a bulky size.
Innovation Solution
A miniaturized optical sensor package is designed by directly forming a light source and a light blocking wall on the base layer of the optical sensor chip, with a manufacturing method involving the arrangement of a first light blocking wall between the light detection region and the light source, followed by encapsulation with a transparent layer and the formation of a second light blocking wall using opaque plastic.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a light blocking cover is arranged on the printed circuit board to separate the light source and optical sensor chip, then light blocking function is achieved, but the package size becomes large
Solution Approach 1:
The patent merges the light blocking wall with the base layer of the optical sensor chip by directly forming it on the chip substrate. This integration eliminates the need for a separate light blocking cover on the printed circuit board, thereby achieving light blocking function while significantly reducing the overall package size.
Solution Approach 2:
The light blocking wall is formed extending vertically from the base layer of the optical sensor chip upward, creating a three-dimensional structure. This vertical dimension approach allows effective light blocking without occupying additional horizontal space on the printed circuit board, thus reducing package footprint.
2Area of stationary object
If the light source and light blocking wall are directly formed on the base layer of optical sensor chip, then package size is reduced, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is divided into distinct sequential steps: first forming the light blocking wall on the base layer, then encapsulating with transparent material, and finally forming the groove. This segmentation of the manufacturing process makes the complex integration manageable and systematic.
Solution Approach 2:
The light blocking wall is formed on the base layer before the encapsulation process. This preliminary action allows the light blocking structure to be integrated into the chip assembly early in the manufacturing sequence, simplifying subsequent steps and enabling better process control.
3Stability of the object's composition
If a transparent layer is formed to encapsulate the optical sensor chip and light blocking wall, then protection and integration are achieved, but access to the light blocking wall is lost
Solution Approach 1:
The encapsulation structure is segmented by forming a groove that penetrates the transparent layer, creating distinct regions: an enclosed space for protection and an exposed region for access. This segmentation allows the transparent layer to simultaneously provide encapsulation protection while maintaining accessibility to the light blocking wall through the groove opening.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the package size by integrating the light source and light blocking wall on the optical sensor chip, eliminating stray light interference and enabling a more compact design suitable for smaller devices.
Implementation Method 1
injecting opaque plastic, in a fluid state or semi-fluid state, in the groove and then curing the opaque plastic to form a second light blocking wall
Data Source
AI summary
There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.