Miniaturized Sealed Electronic Devices Using Sacrificial Carrier Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing implantable electronic devices face challenges in surviving a moist and oxygen-rich environment due to degradation, and traditional sealing methods result in a larger footprint than necessary, compromising device longevity and size efficiency.
Innovation Solution
A method involving a sacrificial carrier substrate, releasable adhesive, electrically insulating layer, and curable adhesives to create a miniaturized sealed electronic device with a reduced footprint, using a barrier material and sealant to protect the device while minimizing the edge seal, allowing for release from the carrier substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional sealing methods are used to protect electronic devices from moisture and oxygen, then device reliability is improved, but device footprint increases
Solution Approach 1:
The sealing structure is divided into multiple functional layers: a flexible barrier layer conformally coating the device edges, a curable adhesive layer providing structural support and sealing, and an electrically insulating layer providing additional protection. This segmentation allows each layer to be optimized for its specific function while collectively achieving reliable protection with minimal footprint.
Solution Approach 2:
The patent employs a flexible barrier layer that conformally coats the edges of the electronic device, creating a thin-film seal that follows the device contours. This flexible film approach provides effective moisture and oxygen barrier protection without requiring bulky encapsulation structures, thus maintaining a small device footprint while ensuring reliability.
2Area of moving object
If the edge seal is minimized to reduce device size, then device footprint is reduced, but sealing effectiveness may be compromised
Solution Approach 1:
The sealing structure implements local quality by concentrating the barrier function at the critical device edges through a conformally coated flexible barrier layer, while the broader area is protected by the curable adhesive and electrically insulating layers. This localized approach to sealing effectiveness allows minimal edge seal dimensions while maintaining overall sealing performance.
Solution Approach 2:
The patent uses a composite sealing structure combining a flexible barrier layer (for conformal edge sealing), curable adhesive (for structural sealing), and electrically insulating material (for additional protection). This composite approach enables effective sealing with minimized edge seal dimensions by distributing sealing functions across multiple material layers.
3Manufacturing precision
If a sacrificial carrier substrate is used to enable miniaturization, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The sacrificial carrier substrate is used in preliminary manufacturing steps to precisely position and support the electronic device and sealing layers during fabrication. The carrier enables accurate alignment and conformal coating application before the final release. This preliminary action on the carrier allows high manufacturing precision for miniaturized devices, with the carrier itself being removed after serving its fabrication purpose.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively seals electronic devices in a smaller footprint, enhancing their durability and longevity in moist and oxygen-rich environments without the bulk of traditional encapsulation methods, ensuring protection from moisture and oxygen while maintaining a compact size.
Implementation Method 1
coating a sacrificial carrier substrate with a releasable adhesive solution; curing the releasable adhesive solution to adhere the electrically insulating substrate to the sacrificial carrier substrate
Implementation Method 2
depositing a curable adhesive over and about the electronic device to surround the electronic device; curing the curable adhesive to provide a sealed barrier layer
Implementation Method 3
positioning a barrier material on the curable adhesive; curing the curable adhesive to provide a sealed barrier layer comprising a cured adhesive and the barrier material
Implementation Method 4
depositing a curable sealant to fill the first cut perimeter channel about the electronic device; curing the curable sealant to create a sealed electronic device
Data Source
AI summary
Miniaturized sealed electronic devices and methods of making and using them are disclosed herein. The miniaturized sealed electronic device disclosed herein includes an electronic device, an electrically insulating substrate, a barrier layer (e.g., a barrier material thin film, and/or a barrier material cap), cured adhesive and a sealant. The miniaturized sealed electronic device is made using methods described herein to create a small footprint, with minimal encapsulation, as compared to sealed electronic devices made by traditional methods.