Mini-LED Backlight Source Flexible Circuit Board Integration
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Solution Overview
Problem
Conventional mini-LED backlight sources using glass substrates are fragile, and the light source distribution at the joint between two light boards is uneven, affecting the brightness uniformity of display panels.
Innovation Solution
A double-layer glass substrate structure with a conductive line that passes through a through-hole and is protected by a protective layer, eliminating the need for conventional COF bonding, allowing for a more robust and evenly distributed light source configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If glass substrates are used for active-matrix mini-LED light boards, then the light board can achieve ultra-thin and high-brightness performance, but the glass substrate becomes fragile and difficult to handle
Solution Approach 1:
The patent uses a composite structure combining glass substrate with flexible circuit board (FCB) and protective materials. The glass substrate provides optical performance while the FCB and adhesive layers provide mechanical flexibility and damage resistance, creating a composite structure that balances brightness and reliability.
Solution Approach 2:
The patent introduces protective structures including adhesive layers and flexible circuit boards that cushion and absorb mechanical stress before it reaches the glass substrate. This beforehand cushioning prevents the glass from breaking during handling and assembly processes.
2Adaptability or versatility
If conventional COF bonding process is used to connect flexible circuit board to glass substrate, then driver IC can be disposed on flexible circuit board, but the PCB structure becomes hard to place and affects overall structure design
Solution Approach 1:
The patent segments the circuit board structure into a flexible circuit board (FCB) that can be independently positioned and connected to the glass substrate. This segmentation allows the driver IC to be mounted on the FCB while the FCB itself can be flexibly placed and adjusted during assembly, improving ease of operation.
3Area of stationary object
If adjacent active-matrix mini-LED light boards are spliced to achieve large-size display, then the display size can be increased, but the splicing distance becomes wide resulting in long distance between light sources
Solution Approach 1:
The patent moves the driver circuit from the traditional plane of the glass substrate to a separate flexible circuit board that can be positioned in a different spatial dimension. This dimensional change allows the light sources to be arranged more closely on the glass substrate while the driver circuit is accessed through the FCB connection, reducing splicing distance and improving light source distribution uniformity.
4Ease of manufacture
If conventional PCB structure is used, then the structure is rigid and easy to manufacture, but it cannot achieve ultra-thin design and the splicing distance is relatively wide
Solution Approach 1:
The patent replaces the rigid PCB with a flexible circuit board (FCB) that can be bent and positioned to reduce splicing distance between adjacent light boards. The FCB maintains electrical connectivity while allowing closer arrangement of light sources, achieving both ultra-thin design and reduced splicing distance while remaining manufacturable.
Data Source
AI summary
A backlight source and a manufacturing method thereof are provided. The backlight source includes a first substrate, a plurality of light sources, a driving circuit layer, and a conductive line. The light sources are distributed on an upper surface of the first substrate. The second substrate is disposed opposite to the first substrate. The driving circuit layer is disposed on a surface of a side of the second substrate away from the first substrate. An end of the conductive line is connected to one of the light sources, and another end of the conductive line is bonded to the driving circuit layer.