Mini-LED Backlight Panel Lineless Surface Connector Placement

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Solution Overview

Problem

Current mini-LED backlight structures cannot accommodate connectors and multiple elements on the surface of the glass substrate due to light absorption and shadow generation, limiting the placement of components like connectors and requiring the use of chips on films for circuit connections.

Innovation Solution

A mini-LED backlight structure with a glass substrate having a line surface and a lineless surface, where light emitting diodes and connectors are placed on the lineless surface, and reflective sheets are on the line surface, allowing electrical connection through a conducting wire or via hole, enabling the placement of elements and connectors without affecting the backlight effect and reducing material usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If light emitting diodes and connectors are disposed on the line surface of the glass substrate, then the backlight structure can be completed, but the large area elements absorb light and generate shadows, and connectors cannot be disposed

Engineering Contradiction:
Improveability to dispose connector and elements on glass substrate surfaceVSAvoidlight absorption and shadow generation by elements
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The glass substrate surface is segmented into two distinct surfaces: a line surface and a lineless surface. The lineless surface is used for disposing light emitting diodes and connectors, while the line surface receives reflective sheets. This segmentation allows components to be placed without affecting the backlight effect, as the lineless surface does not create shadow lines.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent utilizes the third dimension by creating a gap between the backplate and the glass substrate. This gap provides additional space for disposing light emitting diodes and connectors on the lineless surface, allowing electrical connection through the gap without interfering with the backlight transmission through the line surface.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If chips on films are used to connect external circuits, then circuit connection is achieved, but the connector cannot be disposed on the glass substrate surface

Engineering Contradiction:
Improvecircuit connection capabilityVSAvoiduse of chips on films instead of direct connector placement
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The glass substrate is divided into line surface and lineless surface, with the lineless surface dedicated for disposing connectors and light emitting diodes. This allows direct placement of connectors on the glass substrate without requiring chips on films, simplifying the overall device structure while maintaining circuit connection capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The gap between the backplate and glass substrate serves as an intermediary space that allows connectors to be electrically connected to external circuits through conducting wires passing through the gap, eliminating the need for chips on films while maintaining connection functionality.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the placement of connectors and elements on the lineless surface without compromising the backlight effect, reducing material costs and eliminating the need for chips on films, thus addressing the limitations of existing mini-LED backlight structures.

Implementation Method 1

a plurality of reflective sheets disposed on the line surface, wherein a gap between the backplate and the glass substrate is for disposing the light emitting diodes and the connector, and light emitting surfaces of the light emitting diodes face toward the plurality of reflective sheets

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS11703630B2Mini-LED backlight panel and mini-LED backlight module
Publication Date: 2023.07.18 TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
  • US11703630B2 patent drawing
  • US11703630B2 patent drawing
  • US11703630B2 patent drawing

AI summary

A mini-LED backlight structure and a backlight module are provided. The mini-LED backlight structure includes a backplate, a glass substrate, and reflective sheets. The glass substrate includes a line surface and a lineless surface close to a side of the backplate. Light emitting diodes and a connector are disposed on the lineless surface. Furthermore, a gap is between the backplate and the glass substrate for disposing the light emitting diodes and the connector. The connector is electrically connected to an external circuit through a conducting wire. Disposing a plurality of elements, the connector, and the light emitting diodes on a same surface of the lineless surface is unlikely affecting backlight effect and saves materials at a same time.