MiniLED Backlight Module Thermal Management via Through-Board Heat Dissipation

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Solution Overview

Problem

Conventional MiniLED backlight modules suffer from high power consumption and excessive heat emission due to the large number of LEDs, leading to reduced brightness and shortened service life of the lamp board.

Innovation Solution

A backlight module design that includes a backplane with a thermally conductive connecting layer between the backplane and the lamp board, and a heat dissipation assembly at the backplane's second surface, which passes through the backplane and connects with the thermally conductive connecting layer to enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a large number of MiniLEDs are used to achieve precise dynamic backlight effect and improve brightness and contrast, then display performance is improved, but power consumption increases and excessive heat is emitted

Engineering Contradiction:

Improvebrightness and contrastVSAvoidpower consumption

Core Design Contradiction:

Illumination intensityVSUse of energy by stationary object

Solution Approach 1:

The backlight module is segmented into multiple independent lamp boards, each equipped with its own heat dissipation assembly. This allows heat to be dissipated locally at each segment rather than accumulating in a centralized system, enabling the use of more LEDs while managing thermal load effectively.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Heat dissipation is addressed by adding a vertical dimension - heat dissipation assemblies extend from the backplane in a direction perpendicular to the lamp board. This three-dimensional heat dissipation structure increases the heat dissipation surface area without increasing the footprint area of the display device.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Illumination intensity

If a large number of MiniLEDs are used to achieve precise dynamic backlight effect, then display performance is improved, but excessive heat reduces lamp board brightness and service life

Engineering Contradiction:

ImprovebrightnessVSAvoidservice life

Core Design Contradiction:

Illumination intensityVSReliability

Solution Approach 1:

A thermally conductive connecting layer is introduced as an intermediary between the lamp board and heat dissipation assembly. This intermediate component efficiently transfers heat from the lamp board to the heat dissipation assembly, protecting the lamp board from excessive heat while maintaining its brightness and extending its service life.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The heat generated by MiniLEDs, which is normally a harmful factor reducing service life, is converted into a manageable parameter by directing it through thermally conductive connecting layers to heat dissipation assemblies. The heat is transformed from a destructive force into a controlled thermal flow that can be efficiently dissipated.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Device complexity

If traditional dynamic backlight is used, then structure is simpler, but glare phenomenon occurs between bright and dark regions

Engineering Contradiction:

Improvebacklight structureVSAvoidglare phenomenon

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The backlight system is divided into multiple independently controllable lamp boards that can be dynamically adjusted. This segmentation enables precise local dimming control, allowing different brightness levels in different regions of the screen, thereby eliminating the glare phenomenon between bright and dark regions while maintaining a relatively simple overall structure.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed design improves heat dissipation efficiency, protects the lamp board, and extends its service life by effectively managing heat generated by the MiniLEDs.

Implementation Method 1

a thermally conductive connecting layer, arranged between the backplane and the lamp board, and the thermally conductive connecting layer is connected with the lamp board

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat dissipation assembly, arranged at the second surface of the backplane, and the heat dissipation assembly passes through the backplane and is then connected with the thermally conductive connecting layer

Methodology Applied

Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS12234979B2Backlight module and display device

Publication Date: 2025.02.25 BEIJING JINGDONGFANG CHAGU ELECTRONICS

AI summary

A backlight module and a display device. The backlight module includes a backplane (1), a lamp board (2), a thermally conductive connecting layer (3), and a heat dissipation assembly (4), the backplane (1) has a first surface and a second surface, which are opposite each other; the lamp board (2) is arranged on the first surface of the backplane (1); the thermally conductive connecting layer (3) is arranged between the lamp board (2) and the backplane (1), and the thermally conductive connecting layer (3) is connected to the lamp board (2); the heat dissipation assembly (4) is arranged on the second surface of the backplane (1), and the heat dissipation assembly (4) passes through the backplane (1) and is then connected to the thermally conductive connecting layer (3).