MIPI Synchronous Serial Interface for Shared RF FE Die Communication

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The high integration level and complexity of RF FE chip interfaces, particularly with MIPI protocols, lead to excessive die area and power consumption due to separate functional circuits on different dies, and the use of GPIO interfaces results in an excessive number of traces for signal transmission.

Innovation Solution

A synchronous serial communication device and method utilizing an MIPI main control chip, MIPI interface module, and RF FE dies, with re-encoding of clock and data signals, allowing parallel connection of RF FE dies to share signals and decode data efficiently through internal buses and re-encoding output modules.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If functional circuits are distributed on different dies, then integration level is improved, but die area and power consumption become excessively large

Engineering Contradiction:
Improveintegration levelVSAvoiddie area
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent merges multiple functional circuits onto a single die, eliminating the need for inter-die signal transmission. This consolidation reduces the total die area required while maintaining high integration levels, directly resolving the contradiction between distribution across dies and area consumption.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements a universal interface module that can handle multiple communication protocols and functions within a single die. This multi-functional approach allows the system to maintain high adaptability and integration without requiring separate dedicated circuits for each function, thereby reducing overall die area.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If functional circuits are distributed on different dies, then integration level is improved, but power consumption becomes excessively large

Engineering Contradiction:
Improveintegration levelVSAvoidpower consumption
Core Design Contradiction:
Adaptability or versatilityVSUse of energy by stationary object

Solution Approach 1:

By consolidating functional circuits onto a single die, the patent eliminates power consumption associated with inter-die signal transmission and multiple separate circuit operations. This merging approach maintains high integration while significantly reducing overall power consumption.

Inventive Principle:
Principle #5Merging (Combining)

3Adaptability or versatility

If signals between dies are transmitted through GPIO interfaces, then communication flexibility is improved, but quantity of traces becomes excessively large

Engineering Contradiction:
Improvecommunication flexibilityVSAvoidquantity of traces
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical/physical GPIO interface system with an integrated on-die communication system. This substitution eliminates the need for extensive external trace routing while maintaining communication flexibility through software-configurable interfaces, directly resolving the contradiction between flexibility and trace quantity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent implements a nested communication architecture where multiple communication channels and protocols are embedded within a single integrated interface module. This nesting approach allows flexible communication between different functional blocks without requiring separate external traces for each channel, thereby reducing trace complexity.

Inventive Principle:
Principle #7Nested doll (Nesting)

Data Source

PatentEP4718272A1Synchronous serial communication device and method
Publication Date: 2026.04.01 VANCHIP TIANJIN TECH
  • EP4718272A1 patent drawingFigure 1~2
  • EP4718272A1 patent drawingFigure 3~4
  • EP4718272A1 patent drawingFigure 5

AI summary

Disclosed in the present invention are a synchronous serial communication device and method. The method comprises: an MIPI main control chip generating an MIPI instruction and sending same to an MIPI module; the MIPI module screening serial clock signals and serial data signals in real time, and recoding the screened information; sending the recoded information to all radio frequency front-end interface dies; and the radio frequency front-end interface dies decoding the recoded information, and sending the decoded data information to a follow-up module by means of an IO port. Under the same scale, compared with a traditional MIPI circuit, a logic circuit on a die for using the present invention to realize internal data communication can save 75% of area, and MIPI information can take effect synchronously at the end of an MIPI frame, such that extra information transmission time is not needed, and the working efficiency of synchronous serial communication is improved.