Mirror Adhesive Bonding Low CTE and Moisture Resistance

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Solution Overview

Problem

Current adhesives for lightweight mirrors in space-based imaging applications face challenges such as limited CTE matching, short working life, incompatibility with porous 3D printed cores, high viscosity, and high cure temperatures, making them unsuitable for materials like Zerodur®, Clearceram™, and cordierite, which are desirable for high precision applications.

Innovation Solution

Development of adhesive formulations with low CTE (<0.5 ppm/°C) and low cure temperatures (100-400°C) that include fused silica particles and activators like sodium silicate and monoaluminum phosphate, allowing for bonding of low CTE materials and enabling compatibility with sensitive core materials, while maintaining good bond strength and resistance to moisture absorption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional adhesives are used for bonding faceplate to core, then bond strength is achieved, but CTE matching is limited and moisture absorption increases

Engineering Contradiction:
Improvebond strengthVSAvoidCTE matching and moisture absorption
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The adhesive formulation uses a composite system combining fused silica particles (70-80 wt%) with a sodium silicate-sodium hydroxide activator system (20-30 wt%). This composite structure provides both strong bonding and ultra-low CTE (<0.5 ppm/°C) to match the core and faceplate materials, while the specific chemical composition reduces moisture absorption compared to conventional epoxies.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The invention changes the chemical composition parameters of the adhesive by using fused silica particles with specific size distribution (1-60 micrometers, average 8-10 micrometers) and an activator system containing 25-50 wt% sodium silicate and 25-50 wt% sodium hydroxide. These parameter changes enable the adhesive to achieve low CTE and improved moisture resistance while maintaining bond strength.

Inventive Principle:
Principle #35Parameter changes

2Stability of the object's composition

If adhesives with low CTE are used, then CTE matching improves, but cure temperature becomes restricted

Engineering Contradiction:
ImproveCTE matchingVSAvoidcure temperature
Core Design Contradiction:
Stability of the object's compositionVSTemperature

Solution Approach 1:

The invention changes the chemical composition parameters of the adhesive by using fused silica particles with specific size distribution (1-60 micrometers, average 8-10 micrometers) and an activator system containing 25-50 wt% sodium silicate and 25-50 wt% sodium hydroxide. These parameter changes enable the adhesive to achieve low CTE and improved moisture resistance while maintaining bond strength.

Inventive Principle:
Principle #35Parameter changes

3Ease of operation

If adhesive viscosity is reduced for easier dispensing, then ease of operation improves, but bond strength may be compromised

Engineering Contradiction:
Improvedispensing through nozzleVSAvoidbond strength
Core Design Contradiction:
Ease of operationVSStrength

Solution Approach 1:

The adhesive formulation incorporates fused silica particles with a specific size distribution (1-60 micrometers, average 8-10 micrometers) that creates a porous yet structurally sound matrix. This particle size distribution allows the adhesive to flow easily through small extrusion nozzles (0.026 to 0.063 inch) while the fused silica framework maintains strong bonding properties and structural integrity.

Inventive Principle:
Principle #31Porous materials

4Productivity

If adhesive working life is extended for larger assemblies, then productivity improves, but cure reliability may be affected

Engineering Contradiction:
Improveworking life for assemblyVSAvoidcure reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The activator system using sodium silicate and sodium hydroxide provides a controlled, progressive curing mechanism that allows the adhesive to remain workable for extended periods (accommodating larger mirror assemblies) while ensuring complete and reliable cure. The chemical reaction progresses systematically, allowing assembly time without compromising final bond reliability.

Inventive Principle:
Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The new adhesive formulations provide strong, low-CTE bonds at lower temperatures, enabling the use of sensitive materials like Zerodur® and Clearceram™, and are stable over extended periods, enhancing the precision and durability of lightweight mirrors.

Implementation Method 1

bonding the faceplate to the core structure is achieved through the use of first adhesive formulations that include: (1) fused silica particles having diameters that range between 1 to 60 micrometers... (2) an activator including 25 to 50 weight % sodium silicate, 25 to 50 weight % sodium hydroxide

Methodology Applied
Scientific EffectChemical Bonding: Chemical Bonding

Implementation Method 2

Some adhesives on the market today have one or more of the following: (1) limited CTE matching capability... These first adhesive formulations advantageously have a low curing temperature in the range of 100 to 250° C., a CTE of less than 0.5 ppm/° C.

Methodology Applied
Scientific EffectThermal Expansion: Thermal Expansion

Data Source

PatentUS20230347596A1Methods of manufacturing mirrors
Publication Date: 2023.11.02 EAGLE TECHNOLOGY LLC
  • US20230347596A1 patent drawing
  • US20230347596A1 patent drawing
  • US20230347596A1 patent drawing

AI summary

Methods of forming a mirror by bonding a faceplate to a core structure using adhesive formulations that include: (1) a binder comprising 40 to 60 weight % monoaluminum phosphate and 40 to 60 weight % water, the binder constituting 25 to 35 weight % of the adhesive formulation and, (2) a composition that includes a first set of particles having a coefficient of thermal expansion equal to or less than 0.05 ppm/° C. and diameters between 1 to 60 micrometers and a second set of particles having a coefficient of thermal expansion equal to or less than 0.05 ppm/° C. and diameters between 0.05 to 1 micrometers, the first set of particles constituting 80 to 85 weight % of the composition, the second set of particles constituting 15 to 20 weight % of the composition; the composition constituting 65 to 75 weigh % of the adhesive formulation.