Optical Mirror Array Assembly With Dual Heat Transport Paths
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Solution Overview
Problem
Existing optical systems in the EUV range face challenges in efficiently dissipating heat from mirrors and electronic components to maintain positional accuracy and avoid thermal deformations, leading to optical aberrations.
Innovation Solution
A dual heat transport path system is implemented, where heat from the mirror array is dissipated through separate paths via a thermally conductive interface component and a heat pipe, using materials with high thermal conductivity and decoupling mechanisms to manage thermal expansion and deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active cooling of mirrors or mirror elements is implemented, then thermal deformation is reduced, but device complexity increases due to the need for cooling mechanisms and vacuum compatibility
Solution Approach 1:
The cooling system is segmented into multiple independent heat transport paths (first heat transport path and second heat transport path) that operate in parallel. Each path provides redundant cooling capability, allowing the system to manage thermal loads effectively without requiring a single complex cooling mechanism.
Solution Approach 2:
The cooling mechanism operates within a vacuum environment (inert atmosphere for EUV optics), requiring the cooling system to be vacuum-compatible. The patent designs the cooling paths to maintain vacuum tightness while efficiently transporting heat away from the mirrors.
2Illumination intensity
If high power light source is used, then illumination intensity increases, but thermal load on mirrors increases leading to deformation
Solution Approach 1:
The patent converts the harmful thermal energy absorbed by the mirrors into a manageable heat transport problem. By implementing dedicated heat transport paths that efficiently conduct heat away from the mirrors, the system transforms the thermal load (harm) into a controlled thermal management process (benefit), allowing high power operation without mirror deformation.
3Ease of operation
If electronic components are placed near mirrors for control, then ease of operation improves, but parasitic heat from electronics degrades mirror performance
Solution Approach 1:
The patent extracts the harmful parasitic heat from the electronic control components and directs it through dedicated heat transport paths to cooling mechanisms. This separation allows electronic components to remain accessible for control while their thermal interference with the mirrors is actively managed and removed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages thermal loads, maintaining positional accuracy and reducing optical aberrations by separating heat dissipation paths, ensuring precise operation of the optical system.
Implementation Method 1
at least one heat pipe arranged to transport heat away from the mirror array
Implementation Method 2
The second heat transport path extends via at least one heat pipe from the mirror array to a cooling mechanism
Implementation Method 3
The first heat transport path extends via an interface component... produced from a material with a thermal conductivity of at least 10 W/(m·K)
Data Source
AI summary
An assembly for an optical system having a mirror array having a plurality of mirror elements arranged on a first carrier. The first carrier contains control leads to the mirror elements. A first heat transport path can dissipate heat from the mirror array to a cooling mechanism during the operation of the optical system. At least one second heat transport path dissipates heat from the mirror array to a cooling mechanism during the operation of the optical system. The first heat transport path and the at least one second heat transport path are spatially separated from one another at least in regions. The first heat transport path extends via an interface component. The first heat transport path extends via the first carrier and the interface component from the mirror array to a cooling mechanism surrounding the interface component.