Rearview Mirror Circuit Integration via Conductive Tracings
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing rearview mirror assemblies face increased complexity, cost, and styling constraints due to the need for circuit boards, which require additional components and interconnections, making testing difficult and potentially causing electromagnetic interference (EMI) issues.
Innovation Solution
The solution involves mounting electronic components directly on the rear surface of a substrate within the rearview mirror element, eliminating the need for circuit boards and reducing interconnections, while using conductive tracings for electrical coupling, thereby simplifying the assembly and reducing EMI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If circuit boards are used to support electronic components, then electronic accessories can be integrated into the mirror assembly, but the complexity, component count and cost of the mirror assembly increases
Solution Approach 1:
The patent merges the circuit board function directly into the mirror element by applying conductive tracings to the rear surface of the substrate. This integration eliminates the need for separate circuit boards and reduces the number of discrete components, thereby maintaining adaptability while reducing overall assembly complexity
Solution Approach 2:
The mirror element substrate serves multiple functions: it provides the reflective surface for mirror functionality and simultaneously serves as the mounting platform for electronic components through conductive tracings. This multi-functionality reduces the need for additional supporting structures and simplifies the overall assembly
2Adaptability or versatility
If circuit board is placed within the housing to support components, then electronic accessories can be mounted, but the housing must be made larger and deeper, imposing styling constraints
Solution Approach 1:
The patent combines the electronic component mounting function with the mirror element itself by applying conductive tracings to the rear surface of the substrate. This eliminates the need for additional space within the housing that would be required to accommodate separate circuit boards, thereby maintaining component mounting capability while reducing housing volume and preserving styling flexibility
3Adaptability or versatility
If multiple circuit boards are used for display and other components, then all electronic components can be interconnected, but the volume occupied by circuit boards within the housing increases
Solution Approach 1:
The patent merges the functionality of multiple circuit boards into a single integrated structure by applying conductive tracings directly to the rear surface of the mirror element substrate. This allows all electronic components to be interconnected on a single plane, eliminating the need for multiple stacked circuit boards and reducing the volume they occupy within the housing
Solution Approach 2:
The patent transitions from a three-dimensional stacked arrangement of multiple circuit boards to a two-dimensional planar arrangement by applying all conductive tracings and electronic components to the rear surface of the substrate. This dimensional change allows for more efficient space utilization and reduces the overall volume occupied by the electronic assembly
4Adaptability or versatility
If circuit components are provided on circuit boards, then electronic accessories can function, but electromagnetic fields are generated that cause interference to other electronic components
Solution Approach 1:
The patent merges the electronic circuitry directly with the mirror element substrate, eliminating the need for separate circuit boards. This integration reduces the overall surface area and distance between conductive elements, thereby minimizing the generation of electromagnetic fields and reducing interference with other electronic components in the vehicle
Data Source
AI summary
According to the present invention, a rearview mirror comprises a first substrate having a front surface and a rear surface, a reflective coating disposed on a surface of the first substrate, and an electronic circuit component secured to the rear surface of the first substrate. The mirror element may be an electrochromic mirror element comprising a transparent second substrate positioned in front of the first substrate. The electronic component secured to the rear surface may be a component of a drive circuit for the electrochromic mirror element. The rearview mirror element may further comprise electrically conductive tracings provided on the rear surface of the first substrate electrically coupled to the electrical component. The tracings may be used to electrically couple the drive circuit to the electrodes of the electrochromic mirror element. The tracings may be deposited on the rear surface using numerous methods including inkjet printing techniques.


