Mirror-Finished LED Substrate for Uniform Light Emission
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Solution Overview
Problem
Conventional LED light sources mounted on ceramic substrates face challenges in achieving stable light-emission surfaces due to variations in light axis, flatness, and reflectivity, which affect the uniformity and positional accuracy of light emission, especially when using chip LEDs.
Innovation Solution
A substrate with a mirror-finished surface, featuring a metal thin-film wiring layer on a glass substrate that includes insulating and light-transmission spaces, allowing for stable light emission and improved environmental resistance, is used to mount LED elements within a sealed container for uniform light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ceramic substrate with silver paste wiring is used to supply electricity to LED elements, then an electricity-supplying circuit is formed, but light reflectivity changes with the color and width of the silver wiring layer, affecting light emission uniformity
Solution Approach 1:
The patent changes the material parameter of the wiring layer from silver paste to aluminum thin-film, and changes the substrate surface property from ordinary ceramic surface to mirror-finished surface. This parameter change ensures uniform light reflection across the entire substrate surface, eliminating the reflectivity variations caused by different silver wiring layer colors and widths.
Solution Approach 2:
The patent creates a homogeneous mirror-finished surface across the entire substrate, including areas with wiring layers. The aluminum thin-film wiring layer is integrated into this uniform mirror surface, ensuring consistent light reflection properties throughout the substrate, thereby achieving homogeneous light emission.
2Ease of operation
If a chip LED is mounted on a ceramic substrate, then the LED element can be installed, but it is difficult to adjust the flatness of the ceramic substrate, the angle of the attached reflector, and the flatness of the surface mount, causing the light emission axis to vary
Solution Approach 1:
The patent performs preliminary actions by pre-forming the mirror-finished surface and pre-integrating the aluminum thin-film wiring layer into this uniform surface before mounting the LED element. This preliminary preparation ensures that the substrate provides a consistent, flat mounting surface with uniform optical properties, eliminating the need for post-mounting adjustments and ensuring consistent light emission axis.
3Strength
If conventional LED elements with plastic enclosures are used, then the LED element is protected, but the external dimensions make it harder to increase the resolution of the LED light-emission spacing
Solution Approach 1:
The patent extracts the LED element from its conventional plastic enclosure and mounts it directly onto the mirror-finished substrate with integrated aluminum thin-film wiring. This extraction eliminates the bulky plastic housing, significantly reducing the external dimensions of the LED element while the substrate provides the necessary electrical connection and structural support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures consistent and uniform light emission, enhances moisture and heat resistance, and enables higher resolution displays such as 5×7-dot and 16×16-dot configurations, improving the overall performance and durability of LED light sources and displays.
Implementation Method 1
the wiring layer for supplying electricity to the LED element is formed on a mirror-finished surface on the entirety of a substrate surface on which the LED element is mounted
Implementation Method 2
the wiring layer forming this electricity-supplying circuit is a metal thin-film formed on the mirror-surface glass substrate. In particular, the substrate for mounting an LED element is characterized in that the metal thin-film is an aluminum thin-film
Data Source
AI summary
Provided is a substrate for mounting an LED element in which a stable light-emitting surface is obtained, as well as a light source and an LED display using this substrate, so that the axis at which light is emitted by a chip LED does not vary. The substrate for mounting an LED element (1) comprises a substrate (1a) on which an LED element can be mounted, and a wiring layer (2) for supplying electricity to an LED element (7). The wiring layer (2) for supplying electricity to the LED element (7) is formed on a mirror-finished surface on the entirety of a substrate surface on which the LED element is mounted, except for an insulating space 4 capable of providing insulation between terminals of the LED element.