Rearview Mirror Micro-LED Chiplets With Integrated Sensor Feedback

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Solution Overview

Problem

Existing rearview mirror assemblies lack efficient integration of advanced display technologies and sensors, leading to limited space for additional functionalities and suboptimal performance monitoring.

Innovation Solution

Incorporation of micro-LEDs on chiplets with integrated sensors and emitters, allowing for enhanced space utilization and performance monitoring through a control system that ensures image accuracy and adjusts display settings based on sensor feedback.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If traditional LED or LCD technology is used in rearview mirror assemblies, then the display structure is simpler and easier to manufacture, but the available space for additional functional components is limited

Engineering Contradiction:
Improveavailable space for functional componentsVSAvoiddisplay structure complexity
Core Design Contradiction:
Area of moving objectVSDevice complexity

Solution Approach 1:

The display is segmented into individual micro-LED chips mounted on a backplane, allowing each chip to be independently positioned and configured. This segmentation enables efficient space utilization by arranging display elements and functional components in a modular fashion, maximizing the use of available area in the rearview mirror assembly.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from planar LED/LCD displays to a three-dimensional micro-LED architecture where chips are mounted on a backplane at various positions and orientations. This dimensional change allows functional components to be integrated in the depth dimension, significantly increasing the available space for sensors and other electronics without increasing the front surface area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If micro-LEDs are integrated with sensors and emitters on chiplets, then space efficiency and functional integration are improved, but the device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvefunctional integration capabilityVSAvoidmanufacturing ease
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The backplane serves multiple functions: it acts as the structural support for micro-LED chips, provides electrical interconnections, and serves as a mounting platform for sensors and infrared emitters. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process despite the integrated functionality.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The control system automatically monitors display performance using integrated sensors and performs self-diagnosis and corrective actions without external intervention. This self-service capability simplifies manufacturing quality control by enabling automated detection and correction of display defects during the manufacturing process.

Inventive Principle:
Principle #25Self-service

3Reliability

If integrated sensors are used for performance monitoring, then display accuracy and reliability are improved, but the device complexity increases

Engineering Contradiction:
Improvedisplay performance monitoringVSAvoidsystem complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Sensors are integrated into the display system to continuously monitor parameters such as brightness, color accuracy, and operational status. The control system receives feedback from these sensors and automatically adjusts display parameters or triggers corrective actions, improving reliability while managing complexity through automated closed-loop control.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The monitoring and control functions are merged into the existing display structure, with sensors positioned in close proximity to micro-LED chips and shared circuitry where possible. This merging approach enables performance monitoring without adding separate, independent subsystems, thereby limiting the increase in overall system complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables more functional rearview mirror assemblies with improved space efficiency, enhanced display capabilities, and proactive performance correction, including driver monitoring and environmental adjustments.

Implementation Method 1

a display including a backplane connected to a plurality of chiplets that include an array of micro-LEDs

Methodology Applied
Scientific EffectLight-emitting diode: Light Emitting Diode

Implementation Method 2

an infrared emitter configured to project light in the infrared spectrum

Methodology Applied
Scientific EffectInfrared emission: Infrared Radiation

Implementation Method 3

a light sensing module configured to detect light in the visible spectrum

Methodology Applied
Scientific EffectLight detection: Photoelectric Effect

Implementation Method 4

an infrared sensing module configured to detect light in the infrared spectrum

Methodology Applied
Scientific EffectInfrared detection: Infrared Radiation

Data Source

PatentUS20260014934A1Micro-led display
Publication Date: 2026.01.15 GENTEX CORP
  • US20260014934A1 patent drawing
  • US20260014934A1 patent drawing
  • US20260014934A1 patent drawing

AI summary

A rearview mirror assembly includes a housing, a camera, and a display coupled to the housing. The display includes a backplane connected to a plurality of chiplets that include an array of micro-LEDs. At least one of an infrared emitter configured to project light in the infrared spectrum and a sensor are coupled to and in operable communication with at least one of the chiplets. The sensor is selected from a group comprising a light sensing module configured to detect light in the visible spectrum, an infrared sensing module configured to detect light in the infrared spectrum, and a temperature sensor configured to detect a temperature proximate the temperature sensor.