Mirror-Symmetric Semiconductor Device Terminals
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Solution Overview
Problem
Current semiconductor devices and power modules face challenges in achieving a symmetric layout for opposing sides, which complicates packaging and thermal management, especially in compact designs required for point-of-load power applications on printed circuit boards.
Innovation Solution
A semiconductor device with substantially mirror-symmetric terminals is developed, featuring a semiconductor switch and control element with terminals positioned in a mirror-symmetric arrangement, allowing for easy assembly on either side of a module and facilitating heat dissipation through encapsulation with thermally conductive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional nonsymmetric power module layouts are used, then existing power delivery arrangements can be maintained, but packaging complexity and layout challenges increase for opposing sides of the package assembly
Solution Approach 1:
The patent applies asymmetry in reverse by implementing symmetry - the semiconductor device is designed with mirror-symmetric terminal arrangements where corresponding terminals on opposite sides are equidistant from the centerline. This symmetric design enables identical packaging configurations on both sides of the package assembly, eliminating the layout challenges and packaging complexity associated with conventional asymmetric designs.
2Power
If point-of-load power is provided to multiple loads in a confined area, then power delivery capability is improved, but layout challenges on the printed circuit board increase
Solution Approach 1:
The symmetric terminal design provides universal compatibility for multiple packaging configurations. The same semiconductor device can be identically packaged on both sides of the package assembly, enabling flexible power delivery to multiple loads regardless of their position on the printed circuit board. This multi-functional capability simplifies layout planning while maintaining power delivery capability.
3Volume of moving object
If the physical size of the power module is reduced, then compactness is improved, but thermal dissipation challenges increase
Solution Approach 1:
The patent addresses thermal management in compact modules by utilizing three-dimensional stacking arrangements. Multiple semiconductor devices are vertically stacked and bonded together, with thermally conductive materials positioned between layers. This vertical dimension provides additional thermal pathways, allowing heat dissipation without increasing the planar footprint of the module.
4Adaptability or versatility
If larger passive elements such as inductors are integrated with active elements in a common package, then device integration is improved, but thermal management difficulty increases
Solution Approach 1:
The patent segments the power converter into distinct functional modules - active semiconductor switches and control elements are integrated on semiconductor dies, while larger passive elements like inductors are positioned separately within the same package. This segmentation allows each component to be optimized for its specific thermal requirements while maintaining overall device integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables compact, efficient power modules with improved thermal management and symmetric layout, allowing for easier assembly and reduced layout inconveniences, while maintaining high power ratings.
Implementation Method 1
an encapsulant formed about the first and second semiconductor devices. The first and second semiconductor devices are stacked inductors... facilitating heat dissipation through encapsulation with thermally conductive materials
Data Source
AI summary
A semiconductor device having substantially minor-symmetric terminals and methods of forming the same. In one embodiment, the semiconductor device includes a semiconductor switch having a control node and a switched node, the switched node being coupled to first and second output terminals of the semiconductor device, the first and second output terminals being positioned in a substantially minor-symmetric arrangement on the semiconductor device. The semiconductor device also includes a control element having first and second input nodes and an output node, the first and second input nodes being coupled to first and second input terminals, respectively, of the semiconductor device and the output node being coupled to the control node of the semiconductor switch, the first and second input terminals being substantially center-positioned on the semiconductor device.