Mirror Symmetric TCAM Layout for Shared Search Line

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Solution Overview

Problem

The existing semiconductor layout patterns for ternary content addressable memory (TCAM) require extensive space due to the absence of shared components between adjacent TCAMs, leading to increased process complexity and area utilization challenges.

Innovation Solution

The layout is optimized by making adjacent TCAMs mirror symmetric along an axis, allowing them to share a search line and part of the metal wires, thereby reducing the need for duplicate metal wire formation and optimizing space usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If adjacent TCAMs are designed with separate metal wires for search lines, then each TCAM can be independently connected, but the total area increases and manufacturing complexity increases

Engineering Contradiction:
Improveconnection reliabilityVSAvoidTCAM area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

Adjacent TCAMs share common metal wires for search lines, merging previously separate connections into shared infrastructure. This reduces the total number of metal wires required and decreases the overall TCAM area while maintaining reliable connections through the shared wire structure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

Metal wires are designed to serve multiple TCAMs simultaneously, making them multi-functional. A single metal wire can act as a search line for multiple adjacent TCAMs, increasing resource utilization efficiency and reducing redundant structures.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If adjacent TCAMs are designed with separate metal wires for search lines, then each TCAM can be independently connected, but the manufacturing process becomes more complex

Engineering Contradiction:
Improveconnection reliabilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

By merging the metal wire structures of adjacent TCAMs into shared search lines, the number of fabrication steps is reduced. Instead of forming separate metal layers for each TCAM, a single shared metal wire structure is formed, simplifying the manufacturing process while ensuring reliable connections.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The shared metal wires perform multiple functions by serving as search lines for multiple TCAMs simultaneously. This multi-functionality reduces the overall device complexity and streamlines the manufacturing process by eliminating redundant fabrication steps.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Area of stationary object

If adjacent TCAMs share metal wires, then area is reduced and manufacturing is simplified, but layout flexibility is constrained

Engineering Contradiction:
ImproveTCAM areaVSAvoidlayout flexibility
Core Design Contradiction:
Area of stationary objectVSAdaptability or versatility

Solution Approach 1:

The shared metal wire structure is designed with asymmetric routing that can adapt to different TCAM configurations. By using asymmetric layout techniques, the design maintains area efficiency through sharing while preserving the flexibility to accommodate various TCAM arrangements and sizes.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The metal wire layout incorporates dynamic routing capabilities that can be adjusted during design to meet different connectivity requirements. This allows the shared wire structure to adapt to various TCAM configurations while maintaining the area benefits of sharing.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS11475953B1Semiconductor layout pattern and forming method thereof
Publication Date: 2022.10.18 UNITED MICROELECTRONICS CORP
  • US11475953B1 patent drawing
  • US11475953B1 patent drawing
  • US11475953B1 patent drawing

AI summary

The invention provides a semiconductor layout pattern, the semiconductor layout pattern includes a substrate, a plurality of ternary content addressable memories (TCAM) are arranged on the substrate, the layout of at least two TCAM is mirror symmetric with each other along an axis of symmetry, and the two TCAM are connected to the same search line (SL) together.