Mirrored Lead Power Module Package for Higher Creepage Distance
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Solution Overview
Problem
Existing high-power device packages face challenges in accommodating high voltage applications due to insufficient lead-substrate and lead-lead creepage distances, limiting their operational voltage capabilities.
Innovation Solution
The power module packages incorporate elongated protrusions and notches to increase creepage distances, featuring a standardized lead configuration and transfer-molded design with symmetrical or asymmetrical layouts, enabling higher voltage operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete packages are used in high power applications, then device functionality is achieved, but creepage distance is insufficient for high voltage operation
Solution Approach 1:
The patent introduces elongated protrusions that extend in a direction orthogonal to the lead alignment direction, effectively utilizing the third dimension (depth/height) to increase creepage distance. This dimensional transition allows the package to achieve sufficient creepage distance for high voltage operation without proportionally increasing the planar footprint, thereby resolving the contradiction between high voltage capability and compact dimensions.
Solution Approach 2:
The molding material is segmented into distinct regions including elongated protrusions and notches that create isolated zones. This segmentation divides the electrical path into separate segments with increased spacing, effectively increasing the overall creepage distance between leads while maintaining a compact overall package structure.
2Productivity
If standardized lead configuration is implemented, then manufacturing efficiency is improved, but adaptability to different circuit layouts is reduced
Solution Approach 1:
The patent employs asymmetrical positioning of elongated protrusions and notches within the molding material while maintaining symmetrical lead configuration. This asymmetrical internal structure provides adaptability to different circuit layouts and mounting orientations, while the standardized external lead configuration preserves manufacturing efficiency and assembly simplicity.
Data Source
AI summary
In one general aspect, an apparatus can include a semiconductor die, a molding material disposed around at least a portion of the semiconductor die, and a pair of leads electrically coupled to the semiconductor die and aligned along a first direction from the molding material. The molding material can define an elongated protrusion aligned along a second direction orthogonal to the first direction, and a notch disposed between the pair of leads.