Mirrored Metal LED Package Structure for Heat and Light Output
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Solution Overview
Problem
Existing LED components face challenges in thermal conductivity, power handling capabilities, and durability, particularly in high brightness applications, with a need for improved manufacturability and cost-effectiveness.
Innovation Solution
The development of multi-layered LED devices with metallic substrates and non-metallic layers, such as dielectric layers and PCBs, which enhance thermal conductivity and provide structural support, combined with reflective surfaces and encapsulants to optimize light emission and protect components from improper handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional LED packaging structures are used, then manufacturing simplicity is maintained, but thermal conductivity and power handling capabilities are insufficient
Solution Approach 1:
The LED packaging structure is divided into multiple functional layers including a substrate layer, encapsulant layer, reflective layer, and mounting structure. Each layer performs a specific function (thermal management, light emission, light reflection, mechanical support), allowing the complex system to be manufactured using standardized processes for each component while achieving high power handling capabilities through the integrated multi-layer architecture.
Solution Approach 2:
The patent employs composite material structures combining different materials with complementary properties: thermally conductive substrates (metal ceramics or aluminum nitride) combined with optical encapsulants (epoxy or silicone), and reflective materials (silver or aluminum) integrated into the packaging. These composite structures simultaneously provide thermal management, optical performance, and mechanical strength required for high power applications.
2Temperature
If thermal management features are added to improve heat dissipation, then thermal conductivity increases, but manufacturing complexity and cost increase
Solution Approach 1:
The patent integrates multiple functions into unified components: the substrate simultaneously provides mechanical support, thermal conduction, and electrical isolation; the encapsulant combines light transmission with thermal management; the reflective layer integrates light redirection with thermal reflection. This merging of functions reduces the number of separate manufacturing steps compared to adding discrete thermal management components.
Solution Approach 2:
Each component in the packaging structure serves multiple purposes: the substrate provides structural support, thermal conduction, and electrical isolation; the encapsulant protects the LED chip, transmits light, and assists in thermal management; the mounting structure provides mechanical attachment and thermal pathways. This multi-functionality eliminates the need for separate dedicated thermal management components, simplifying manufacturing while achieving high thermal conductivity.
3Reliability
If durability features are incorporated, then package durability improves, but manufacturing complexity increases
Solution Approach 1:
The encapsulant layer is designed to provide mechanical protection and stress distribution before external forces affect the LED chip. The mounting structure incorporates compliance features that absorb thermal expansion and mechanical stress prior to reaching critical components. These preventive design features are integrated into the basic packaging structure, providing durability without requiring complex additional protection systems.
4Power
If multi-layered structures with metallic substrates are used, then thermal conductivity and durability improve, but manufacturing cost increases
Solution Approach 1:
The patent optimizes key parameters of each layer to achieve high thermal conductivity at reduced cost: substrate thickness and material composition are tuned to provide adequate thermal performance; encapsulant refractive index and thickness are optimized for light extraction; reflective layer reflectivity and positioning are adjusted to maximize optical efficiency. These parameter optimizations allow standard manufacturing processes to produce high-performance packages without requiring exotic or expensive materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves thermal conductivity, allows for higher power input, enhances durability, and reduces manufacturing costs while maintaining efficient light output, making the LED components more robust and cost-effective.
Implementation Method 1
a substrate comprising metal and a mirror... increasing thermal conductivity
Implementation Method 2
a substrate comprising metal and a mirror... optimize light emission
Data Source
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AI summary
Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a metallic substrate with a mirrored surface, one or more light emitter devices mounted directly or indirectly on the mirrored surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the mirrored metal substrate by one or more non-metallic layers. Components disclosed herein can result in improved thermal management and light output.