Mirrored Voltage Regulator PCB Layout for Noise Cancellation
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Solution Overview
Problem
Conventional voltage regulators in high-current applications face challenges with increased acoustic noise, electromagnetic noise, and operating temperatures due to the arrangement of multiple regulators on a printed circuit board, which limits their use in devices requiring higher currents and affects user experience.
Innovation Solution
A double-sided printed circuit board design with mirrored components on opposite surfaces, including power stages and inductors, to cancel electromagnetic noise and minimize acoustic noise, while improving heat transfer and packaging efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple voltage regulators are arranged on a printed circuit board to increase current capability, then the current output capability is improved, but electromagnetic noise and acoustic noise increase
Solution Approach 1:
The patent transitions from a single-sided PCB layout to a double-sided PCB layout, utilizing the third dimension (z-axis) by placing components on both surfaces of the board. This spatial reconfiguration allows opposing phases to be positioned face-to-face, enabling noise cancellation while maintaining high current capability through multiple regulators.
Solution Approach 2:
The patent employs asymmetric phase arrangement where odd phases are positioned on one side of the PCB and even phases on the other side. This asymmetric distribution creates opposing magnetic fields that cancel each other, reducing electromagnetic noise while maintaining balanced current distribution across all phases.
2Power
If multiple voltage regulators are arranged on a printed circuit board to increase current capability, then the current output capability is improved, but operating temperatures increase
Solution Approach 1:
By distributing power stages across both sides of the PCB, the patent utilizes vertical space to separate heat-generating components. This three-dimensional arrangement improves thermal dissipation by reducing heat concentration on any single surface, allowing higher current capability without excessive temperature rise.
Solution Approach 2:
The patent divides the power system into multiple independent phases distributed across both PCB surfaces. This segmentation allows heat to be distributed across multiple locations rather than concentrated in one area, improving overall thermal management and enabling higher total power output.
3Power
If the number of voltage regulators is increased to meet higher current requirements, then the current capability is improved, but device footprint increases
Solution Approach 1:
The patent utilizes the z-dimension by implementing a double-sided PCB design, allowing components to be stacked vertically across two surfaces. This approach effectively doubles the component capacity within the same planar footprint, enabling high current capability without increasing the device's overall footprint.
Solution Approach 2:
The patent combines multiple phases into a single integrated regulator module that utilizes both sides of the PCB. By merging odd and even phases into one cohesive unit with shared control circuitry and synchronized operation, the design achieves high current capability in a compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The mirrored design effectively cancels electromagnetic noise, reduces acoustic noise, and enhances thermal management, allowing for higher current capabilities within a smaller footprint, thus improving user experience and power density in high-current applications.
Implementation Method 1
During operation, the first and second inductors each produce electromagnetic noise in opposing phases resulting in the cancellation of the noise generated by the first and second inductors
Data Source
AI summary
The disclosed technology relates to a power supply circuit that utilizes a double-sided printed circuit board (PCB) that has a first surface and a second surface. The second surface is disposed opposite the first surface. Mounted on the first surface is a first power stage and a first inductor. Mounted on the second surface is a second power stage and a second inductor. The second power stage is disposed opposite the first power stage. The second inductor is disposed opposite the first inductor.