Compact Active Cooling for Missile Circuit Cards
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Solution Overview
Problem
Conventional passive thermal management systems are inadequate for effectively cooling high-power microchips in confined spaces like missiles, where increased heat loads challenge the ability to maintain reliable operation.
Innovation Solution
A compact active cooling system using a closed loop circulation of a cooling fluid through heat exchangers, which actively removes heat from the microprocessor by moving the fluid through a heat sink and a second heat exchanger, ultimately dissipating heat to the missile housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If passive cooling through heatsink is used, then device complexity is reduced, but heat transfer rate becomes insufficient for high-power microchips
Solution Approach 1:
The patent applies hydraulic cooling by circulating liquid coolant through channels in the heatsink and microchip. The cooling system uses a pump to drive coolant flow through heat exchangers integrated into the microchip substrate, enabling active heat removal that overcomes the insufficient heat transfer rate of passive cooling while managing the added system complexity through integrated fluid distribution manifolds
Solution Approach 2:
The patent merges the cooling function directly into the microchip substrate by integrating heat exchangers and coolant channels within the chip structure itself. This combination of computing and cooling functions in a single integrated package enables high heat transfer rates without proportionally increasing overall device complexity, as the cooling system becomes part of the chip architecture rather than a separate assembly
2Power
If active cooling with fluid circulation is implemented, then heat transfer rate increases, but device complexity increases
Solution Approach 1:
The patent implements nesting by placing coolant channels and heat exchangers inside the microchip substrate structure. The cooling system is nested within the chip layers, with fluid distribution manifolds routed through internal channels. This nested arrangement enables active cooling with high heat transfer rates while minimizing the increase in external device complexity, as the cooling components are contained within the chip footprint
Solution Approach 2:
The patent makes the coolant circulation system multi-functional by using the same fluid distribution network for both cooling the microchip and potentially other thermal management tasks. The integrated heat exchangers serve multiple purposes including heat removal, thermal characterization, and potentially waste heat recovery, thereby justifying the added complexity through multiple beneficial functions from a single system
3Reliability
If conventional passive thermal management is used, then reliability is maintained under low heat loads, but cooling effectiveness deteriorates under high heat loads
Solution Approach 1:
The patent implements dynamic cooling by using a pump to actively circulate coolant through the heat exchangers, enabling the system to adapt to varying heat loads. The active fluid circulation allows the cooling capacity to be adjusted and scaled with the thermal demands of high-power microchips, maintaining reliable operation across a wide range of power conditions whereas passive cooling would be overwhelmed under high heat loads
Solution Approach 2:
The patent introduces coolant as an intermediary substance that transfers heat from the microchip to external heat sinks. The liquid coolant acts as a thermal mediator, absorbing heat through convection within the chip channels and transferring it externally through heat exchangers. This intermediary cooling mechanism enables reliable heat removal under high power conditions by decoupling the heat generation and dissipation locations, preventing thermal runaway that would occur with passive cooling alone
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat transfer rates, reducing the risk of component failure and improving reliability by actively managing heat in high-power microprocessor applications, even under conditions of shock and vibration.
Implementation Method 1
heat is transferred from the microchip through a heatsink
Implementation Method 2
fans are used to move air over the heatsink, increasing the heat transfer rate
Implementation Method 3
a cooling fluid contained within closed loop circulation system... actively remove heat from a heat source... by moving a cooling fluid through the heat exchangers
Data Source
AI summary
Methods and apparatus for compact active cooling for missile applications generally comprise a circuit card assembly level closed loop fluid filled cooling system for cooling high power components such as microprocessors. The present invention utilizes a cooling system constrained to a single circuit card assembly providing for a drop in replacement for current passively cooled circuit card assemblies.