Missile Sensor Head Thermal Insulation Design
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Solution Overview
Problem
Missile electronics units face overheating due to frictional heat during high-speed flight, leading to potential functional failure, especially in precision munitions where temperatures exceed the permissible limit of electronic components.
Innovation Solution
A sensor head design featuring a thermal insulation layer between the electronics housing and the sensor head housing, with an essentially rotationally symmetrical outer contour and a radial air gap or insulation material to reduce heat conduction, along with axial distance adjustment elements and support structures to ensure reliable operation under extreme conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the sensor head housing and electronics housing are placed in direct contact to ensure structural stability and reduce device complexity, then the structural strength and manufacturing simplicity are improved, but the electronics unit overheats due to heat conduction from frictional heat during high-speed flight
Solution Approach 1:
A thermal insulation layer is introduced as an intermediary element between the sensor head housing and the electronics housing. This insulation layer acts as a thermal barrier that prevents heat conduction from the hot sensor head housing to the electronics housing, while still maintaining the structural integrity and connection between the two housings during high-speed flight
2Temperature
If a thermal insulation layer is added between the sensor head housing and electronics housing to reduce heat conduction, then the electronics unit temperature is controlled, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The thermal insulation layer is designed to serve multiple functions simultaneously: it provides thermal insulation to protect the electronics unit from overheating, maintains the structural connection between the sensor head housing and electronics housing, and contributes to the overall mechanical strength of the assembly. This multi-functionality reduces the need for additional separate components
3Strength
If the contact surface between sensor head housing and electronics housing is increased to improve structural stability, then the structural strength is improved, but the heat conduction to the electronics unit increases causing overheating
Solution Approach 1:
The thermal insulation layer is applied selectively at the contact interfaces between the sensor head housing and electronics housing, specifically where heat conduction occurs. This localized insulation approach provides thermal protection at the critical heat transfer points while maintaining structural stability through adequate contact surfaces, achieving both thermal protection and structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively mitigates overheating of the electronics unit, ensuring precise guidance of missiles by reducing thermal stress and preventing functional failures, even at high speeds and extreme accelerations.
Implementation Method 1
a thermal insulation layer between the electronics housing and the sensor head housing is arranged
Implementation Method 2
This promotes heat conduction between the two housings, so that the frictional heat can penetrate to the electronics unit
Implementation Method 3
The thermal insulation layer can be arranged in or formed by a gap between the electronics housing and the sensor head housing
Implementation Method 4
In an advantageous embodiment of the invention, the insulating layer is formed by a radial air gap between the electronics housing and the sensor head housing
Data Source
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AI summary
The invention relates to a sensor head (8) for a missile (2), comprising a sensor head housing (14), an electronic unit (22), and an electronic housing (84) surrounding the electronic unit (22). A robust sensor head (8) can be achieved if the electronic housing (84) at least predominantly encloses the electronic unit (22) and has a substantially rotationally symmetrical outer contour (92) and is arranged parallel to the axis of rotation (24, 26) in a substantially rotationally symmetrical cavity (20) formed by the sensor head housing (14), wherein a thermal insulation layer (76) is arranged between the electronic housing (84) and the sensor head housing (14).