Misting Fan Assembly with Integrated Plenum for Evaporative Cooling
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Solution Overview
Problem
Existing fan devices face challenges in improving cooling capacity without adding weight, complexity, and cost.
Innovation Solution
A fan device incorporating a mister assembly with a casing, plenum, and capillary structure that releases cooling fluid into the airflow to enhance cooling effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If additional structures and devices are added to improve cooling capacity, then cooling performance is improved, but weight increases
Solution Approach 1:
The mister assembly is integrated with the fan housing, merging the cooling fluid storage and delivery function with the existing fan structure. The plenum is formed within the housing itself, and the mister assembly shares the fan's airflow path, combining multiple functions into a unified structure that provides both air movement and evaporative cooling without requiring separate independent systems
Solution Approach 2:
The fan housing serves multiple functions: it encloses the fan motor, directs airflow, and simultaneously houses the plenum for cooling fluid storage. The airflow path serves dual purposes by moving air for cooling and by providing the evaporation medium for the mister assembly. This multi-functionality reduces the need for additional dedicated components
2Temperature
If additional structures and devices are added to improve cooling capacity, then cooling performance is improved, but device complexity increases
Solution Approach 1:
The mister assembly is integrated with the fan housing, merging the cooling fluid storage and delivery function with the existing fan structure. The plenum is formed within the housing itself, and the mister assembly shares the fan's airflow path, combining multiple functions into a unified structure that provides both air movement and evaporative cooling without requiring separate independent systems
Solution Approach 2:
The mister assembly incorporates a porous material through which cooling fluid is distributed. This porous structure naturally distributes the fluid across multiple points in the airflow path without requiring complex piping or multiple separate nozzles, simplifying the overall device architecture while maintaining effective cooling coverage
3Temperature
If additional structures and devices are added to improve cooling capacity, then cooling performance is improved, but manufacturing cost increases
Solution Approach 1:
The mister assembly is integrated with the fan housing, merging the cooling fluid storage and delivery function with the existing fan structure. The plenum is formed within the housing itself, and the mister assembly shares the fan's airflow path, combining multiple functions into a unified structure that provides both air movement and evaporative cooling without requiring separate independent systems
Solution Approach 2:
The mister assembly incorporates a porous material through which cooling fluid is distributed. This porous structure naturally distributes the fluid across multiple points in the airflow path without requiring complex piping or multiple separate nozzles, simplifying the overall device architecture while maintaining effective cooling coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of a mister assembly with a plenum and capillary structure enhances cooling efficiency by atomizing cooling fluid into the airflow, improving cooling performance without increasing weight or complexity.
Implementation Method 1
a capillary structure positioned in the plenum and extending through the outer body, the vane, and to the opening of the centerbody
Implementation Method 2
releases cooling fluid into the airflow to enhance cooling effectiveness
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
A fan device is provided, the fan device including a fan and a mister assembly. The fan is configured to provide a flow of air through a fan flowpath. The mister assembly includes a casing having an outer body, a centerbody, and a vane extending between the outer body and the centerbody. A plenum is formed in the casing to store a cooling fluid. The plenum extends through the outer body, the vane, and the centerbody. The centerbody includes an opening through which the cooling fluid is releasable from the plenum into fluid communication with the flow of air.