Multi-tip AFM Probes for Sub-10 nm Nanoscale Analysis
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Solution Overview
Problem
Existing scanning probe microscopy techniques face challenges in scaling down to sub-10 nm nodes due to wavelength limitations of optical microscopy, and conventional methods like FIB and SEM induce charge that can break ultra-thin transistor layers, while single-tip AFM is limited in characterizing nanoscale phenomena such as dislocations and grain boundaries, and multiple-tip SPMs are complex and expensive to manufacture.
Innovation Solution
Development of multiple integrated tip (MiT) probes that integrate mechanical and electrical functionality in a monolithically-fabricated nano-structure with two or more tips, capable of performing atomic force microscopy without laser alignment, and enabling nanoprobing with integrated transistors to amplify signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional optical microscopy techniques are used, then analysis can be performed, but resolution is limited due to wavelength constraints
Solution Approach 1:
The patent replaces optical microscopy techniques with scanning probe microscopy (SPM) methods. Specifically, it uses atomic force microscopy (AFM) probes with tip radii of curvature less than 10 nm to achieve sub-10 nm resolution, substituting the optical field-based measurement with a mechanical contact-based measurement that is not constrained by wavelength limitations.
2Measurement precision
If FIB or SEM techniques are used for failure analysis, then imaging capability is provided, but induced charge breaks ultra-thin transistor layers
Solution Approach 1:
The patent replaces charge-based imaging techniques (FIB and SEM) with mechanical contact-based AFM imaging. The AFM probe uses physical contact or near-contact forces to image the sample surface, eliminating the harmful electromagnetic radiation and charge induction that damage ultra-thin transistor gate oxide layers in conventional electron microscopy methods.
Solution Approach 2:
The AFM probe provides both imaging and electrical measurement capabilities through a single non-destructive measurement process. The probe tip simultaneously performs topographic imaging and electrical characterization (such as conductive AFM or Kelvin probe force microscopy), eliminating the need for separate FIB pad deposition steps that introduce harmful charges.
3Reliability
If single-tip AFM is used, then non-destructive analysis is achieved, but trans-conductance measurements and characterization of dislocations are inaccessible
Solution Approach 1:
The patent merges multiple probe tips onto a single AFM probe holder, creating a multi-tip AFM system. This integration allows simultaneous or sequential performance of multiple measurement types including topographic imaging, trans-conductance measurements, and dislocation characterization, all while maintaining the non-destructive advantages of AFM. The multiple tips enable differential measurements and provide redundancy for comprehensive material characterization.
4Adaptability or versatility
If multiple-tip SPM is implemented to overcome single-tip limitations, then measurement versatility improves, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent combines multiple probe tips onto a single monolithic substrate or probe holder using standard semiconductor fabrication techniques. This integration approach simplifies manufacturing by treating the multi-tip probe as a single fabricated component rather than assembling multiple independent probes. The monolithic structure reduces alignment complexity and enables mass production, thereby reducing costs while maintaining measurement versatility.
Solution Approach 2:
The multi-tip AFM probe is designed with universal functionality, where each tip can perform multiple measurement types (topography, electrical properties, mechanical properties) and the probe system can characterize various phenomena (dislocations, grain boundaries, trans-conductance) using different tip configurations. This universal design reduces the need for multiple specialized probes, simplifying the overall system complexity.
Data Source
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AI summary
Systems and methods for manufacturing multiple integrated tip probes for scanning probe microscopy. According to an embodiment is a microscope probe configured to analyze a sample, the microscope probe including: a movable probe tip including a terminal probe end; a first actuator configured to displace the movable probe tip along a first axis; and a detection component configured to detect motion of the movable probe tip in response to an applied signal; where the moveable probe tip comprises a metal layer affixed to a supporting layer, at least a portion of the metal layer at the terminal probe end extending past the supporting layer.