Mixed-Bond Semiconductor Packaging for Fine-Pitch Die Integration
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Solution Overview
Problem
Existing semiconductor packaging techniques face challenges in achieving smaller form factors and improved device performance while balancing cost-effectiveness, particularly in stacked semiconductor devices that require sophisticated bonding processes.
Innovation Solution
A hybrid bonding method is employed to connect a first die to an interface die, utilizing direct metal-to-metal bonds for finer pitch connections, while a second die is solder bonded to the interface die, reducing costs and improving device performance through smaller pitch scalability and electrical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If hybrid bonding is used for finer pitch connections, then manufacturing precision and device performance improve, but manufacturing complexity and cost increase
Solution Approach 1:
The bonding process is segmented into two distinct types: hybrid bonding for the first die-to-interface die connection to achieve finer pitch precision, and solder bonding for the second die-to-interface die connection to reduce complexity and cost. This segmentation allows each bonding type to be optimized for its specific function without requiring the entire package to use the more complex hybrid bonding process.
2Reliability
If hybrid bonding is used for all connections, then device performance and bandwidth improve, but manufacturing cost increases
Solution Approach 1:
Different bonding qualities are applied locally to different dies based on their specific requirements. The first die uses hybrid bonding with direct metal-to-metal connections for superior electrical performance and bandwidth where needed, while the second die uses solder bonding where lower cost is acceptable. This local differentiation optimizes the balance between performance and cost across the package.
3Ease of manufacture
If solder bonding is used for all connections, then manufacturing cost decreases, but bonding pitch scalability and electrical performance deteriorate
Solution Approach 1:
The bonding approach is segmented such that hybrid bonding is applied specifically to the first die connection where finer pitch scalability is required, while solder bonding is used for the second die connection where cost reduction is the primary objective. This segmentation allows the package to achieve finer pitch connections where necessary without incurring the high costs of universal hybrid bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables smaller form factor packages with improved mechanical endurance, electrical performance, higher bandwidth, and reduced defects, while maintaining cost-effectiveness by combining hybrid and solder bonding techniques.
Implementation Method 1
hybrid bonding a first die to an interface die
Implementation Method 2
solder bonding a second die to the interface die
Data Source
AI summary
A semiconductor package including hybrid bonding and solder bonding along a first interface and methods of forming the same are disclosed. In an embodiment, a package includes a first interposer, the first interposer including a first redistribution structure; a first die bonded to a first surface of the first redistribution structure with a dielectric-to-dielectric bond and a metal-to-metal bond; a second die bonded to the first surface of the first redistribution structure with a first solder bond; an encapsulant around the first die and the second die; and a plurality of conductive connectors on a second side of the first redistribution structure opposite to the first die and the second die.