Mixed-Depth Bridge Cavities for Shorter Chiplet Power Routing
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Solution Overview
Problem
Existing bridge solutions in chiplet architectures either complicate routing by wrapping power around the bridge, increasing path length and reducing performance, or require multiple bridge structures with varying thicknesses due to the use of vias, complicating integration into package substrates.
Innovation Solution
The use of cavities with different depths in package substrates to accommodate various bridge types, including those with and without vias, allowing for efficient power routing through the bridge thickness and reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traces are routed over the bridge to provide power, then power can be delivered within the bridge footprint, but routing complexity increases and power delivery path length increases
Solution Approach 1:
The patent transitions from 2D planar routing (traces over the bridge) to 3D vertical routing (vias through the bridge). By adding the vertical dimension with through-silicon vias, power can pass directly through the bridge thickness, eliminating the need for complex lateral routing around the bridge while maintaining compact footprint.
2Length of moving object
If vias are used to route power through the bridge thickness, then power delivery path length is reduced, but multiple bridge structure types are required and integration complexity increases
Solution Approach 1:
The patent creates a universal cavity depth standard that can accommodate both bridges with vias and bridges without vias. By designing cavities to a standardized depth that works for all bridge types, the system achieves multi-functionality where the same substrate structure supports diverse bridge configurations, eliminating the need for multiple cavity depth specifications.
Solution Approach 2:
The patent changes the cavity depth parameter to a standardized value that optimizes for bridges with vias while still being compatible with bridges without vias. This parameter adjustment allows the system to achieve shorter power delivery paths through vias when needed, while maintaining compatibility with traditional bridge structures.
3Adaptability or versatility
If different cavity depths are used to accommodate different bridge types, then various bridge structures can be integrated, but manufacturing complexity increases
Solution Approach 1:
The patent establishes a universal cavity depth specification that serves multiple bridge types. Instead of creating different cavity depths for different bridge configurations, a single standardized cavity depth is used that can accommodate both vias-equipped bridges and traditional bridges, greatly simplifying the manufacturing process while maintaining versatility.
Data Source
AI summary
Embodiments disclosed herein comprise an apparatus. In an embodiment, the apparatus comprises a substrate with a first cavity into the substrate. In an embodiment, the first cavity has a first depth. In an embodiment, a second cavity is provided into the substrate, where the second cavity has a second depth that is different than the first depth. In an embodiment, a first die is in the first cavity, where the first die has a first thickness. In an embodiment, a second die is in the second cavity, where the second die has a second thickness that is different than the first thickness.