Mixed-Diagonal-Manhattan Routing Conductor Scheme Selection
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Solution Overview
Problem
Conventional integrated circuit layouts using Manhattan routing do not always route signals and voltage sources efficiently, leading to suboptimal conductor layer distribution and potential issues with via misalignment and design rule violations, especially when dealing with shorter diagonal edges.
Innovation Solution
The implementation of mixed-diagonal-Manhattan routing techniques, which involve determining the number of conductor layers based on diagonal and Manhattan edge ratios, and using octilinear Steiner trees to select a conductor scheme that optimizes conductor layer distribution by replacing shorter diagonal edges with Manhattan edges, thereby reducing the number of diagonal layers and increasing Manhattan layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If Manhattan routing is used for conductor layout, then routing simplicity is maintained, but routing efficiency and conductor layer distribution optimization deteriorate
Solution Approach 1:
The routing system is segmented into two distinct types: Manhattan routing for longer edges and diagonal routing for shorter edges. This segmentation allows each routing type to be optimized for its specific use case, with Manhattan routing maintaining simplicity for standard connections and diagonal routing improving efficiency for shorter paths, thereby resolving the contradiction between routing simplicity and routing efficiency.
Solution Approach 2:
The conductor scheme is made dynamic by automatically determining the number of diagonal and Manhattan conductor layers based on the ratio of diagonal to Manhattan edges in the circuit. This dynamic allocation allows the system to adapt the routing capabilities to the actual circuit requirements, optimizing routing efficiency while maintaining operational simplicity where needed.
2Adaptability or versatility
If more diagonal conductor layers are added to improve diagonal routing capacity, then diagonal edge routing capability is improved, but via misalignment issues and design rule violations worsen
Solution Approach 1:
The system changes the parameter of conductor layer allocation by determining the number of diagonal and Manhattan layers based on the actual ratio of diagonal to Manhattan edges in the circuit. This parameter adjustment ensures that diagonal routing capability is enhanced only to the extent needed, preventing over-provisioning that would cause via misalignment and design rule violations, thus maintaining reliability while improving adaptability.
Solution Approach 2:
The conductor scheme is determined in advance during the placement stage by calculating the diagonal to Manhattan edge ratio. This preliminary determination of conductor layer allocation prevents subsequent via misalignment issues by ensuring that the conductor layers are properly configured before routing begins, thereby maintaining via alignment reliability while providing necessary diagonal routing capability.
3Device complexity
If conventional Manhattan routing is used, then layout simplicity is maintained, but conductor layer distribution optimization and design rule compliance worsen
Solution Approach 1:
The layout system transitions from static Manhattan-only routing to a dynamic mixed routing approach where the proportion of diagonal to Manhattan conductor layers is automatically determined based on circuit requirements. This dynamic adaptation enables optimal conductor layer distribution that satisfies design rules while maintaining layout simplicity through automated determination rather than manual configuration.
Solution Approach 2:
The system changes the layout parameters by introducing diagonal routing capability and automatically adjusting the number of diagonal and Manhattan conductor layers based on the diagonal to Manhattan edge ratio. This parameter optimization ensures design rule compliance is achieved while maintaining layout simplicity, as the optimal configuration is determined algorithmically rather than requiring complex manual layout adjustments.
Data Source
AI summary
The routing of conductors in the conductor layers in an integrated circuit are routed using mixed-Manhattan-diagonal routing. Various techniques are disclosed for selecting a conductor scheme for the integrated circuit prior to fabrication of the integrated circuit. Techniques are also disclosed for determining the supply and/or the demand for the edges in the mixed-Manhattan-diagonal routing.